IRL1404ZSTRLPBF

IRL1404ZPbF
IRL1404ZSPbF
IRL1404ZLPbF
HEXFET
®
Power MOSFET
V
DSS
= 40V
R
DS(on)
= 3.1mΩ
I
D
= 120A
06/25/12
www.irf.com 1
Description
This HEXFET
®
Power MOSFET utilizes the latest
processing techniques to achieve extremely low
on-resistance per silicon area. Additional features
of this design are a 175°C junction operating
temperature, fast switching speed and improved
repetitive avalanche rating. These features combine
to make this design an extremely efficient and
reliable device for use in a wide variety of
applications.
S
D
G
Features
l Logic Level
l Advanced Process Technology
l Ultra Low On-Resistance
l 175°C Operating Temperature
l Fast Switching
l Repetitive Avalanche Allowed up to Tjmax
l Lead-Free
D
2
Pak
IRL1404ZSPbF
TO-220AB
IRL1404ZPbF
TO-262
IRL1404ZLPbF
PD - 95446B
Absolute Maximum Ratings
Parameter Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V (Silicon Limited)
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V A
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V (Package Limited)
I
DM
Pulsed Drain Current
P
D
@T
C
= 25°C Power Dissipation W
Linear Derating Factor
W/°C
V
GS
Gate-to-Source Voltage V
E
AS (Thermally limited)
Single Pulse Avalanche Energy
mJ
E
AS
(Tested ) Single Pulse Avalanche Energy Tested Value
I
AR
Avalanche Current A
E
AR
Repetitive Avalanche Energy mJ
T
J
Operating Junction and
T
Storage Temperature Range °C
Soldering Temperature, for 10 seconds
Mounting Torque, 6-32 or M3 screw
Thermal Resistance
Parameter Typ. Max. Units
R
θ
JC
Junction-to-Case ––– 0.65 °C/W
R
θ
CS
Cas e-to-Sink, Flat, Greased Surface 0.50 –––
R
θ
JA
Junction-to-Ambient ––– 62
R
θ
JA
Junction-to-Ambient (PCB Mount) ––– 40
-55 to + 175
300 (1.6mm from case )
10 lbf
in (1.1N
m)
230
1.5
± 16
Max.
200
140
790
120
490
220
See Fig.12a, 12b, 15, 16
IRL1404Z/S/LPbF
2 www.irf.com
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11).
Limited by T
Jmax
, starting T
J
= 25°C,
L = 0.079mH, R
G
= 25Ω, I
AS
= 75A, V
GS
=10V.
Part not recommended for use above this value.
Pulse width 1.0ms; duty cycle 2%.
C
oss
eff. is a fixed capacitance that gives the same
charging time as C
oss
while V
DS
is rising from 0 to
80% V
DSS
.
Limited by T
Jmax
, see Fig.12a, 12b, 15, 16 for typical
repetitive avalanche performance.
This value determined from sample failure population. 100%
tested to this value in production.
This is only applied to TO-220AB package.
When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques
refer to application note #AN-994.
Calculated continuous current based on maximum allowable
junction temperature. Bond wire current limit is 120A. Note that
current limitations arising from heating of the device leads may
occur with some lead mounting arrangements.
All AC and DC test condition based on former Package limited
current of 75A.
S
D
G
S
D
G
Electrical Characteristics @ T
J
= 2C (unless otherwise specified)
Parameter Min. Typ. Max. Units
V
(BR)DSS
Drain-to-Source Breakdown Voltage 40 ––– ––– V
ΔV
(BR)DSS
/ΔT
J
Breakdown Voltage Temp. Coefficient ––– 0.034 ––– V/°C
––– 2.5 3.1
R
DS(on)
Static Drain-to-Source On-Resistance ––– ––– 4.7
mΩ
––– ––– 5.9
V
GS(th)
Gate Threshold Voltage 1.4 ––– 2.7 V
gfs Forward Transconductance 120 ––– ––– S
I
Drain-to-Source Leakage Current ––– ––– 20 μA
––– ––– 250
I
GSS
Gate-to-Source Forward Leakage ––– ––– 200 nA
Gate-to-Source Reverse Leakage ––– ––– -200
Q
g
Total Gate Charge ––– 75 110
Q
gs
Gate-to-Source Charge ––– 28 ––– nC
Q
gd
Gate-to-Drain ("Miller") Charge ––– 40
t
d(on)
Turn-On Delay Time ––– 19 –––
t
r
Rise Time ––– 180 –––
t
d(off)
Turn-Off Delay Time ––– 30 ––– ns
t
f
Fall Time ––– 49 ––
L
D
Internal Drain Inductance ––– 4.5 –– Between lead,
nH 6mm (0.25in.)
L
S
Internal Source Inductance ––– 7.5 –– from package
and center of die contact
C
iss
Input Capacitance ––– 5080 ––
C
oss
Output Capacitance ––– 970 –––
C
rss
Reverse Transfer Capacitance ––– 570 ––– pF
C
oss
Output Capacitance ––– 3310 ––
C
oss
Output Capacitance ––– 870 –––
C
oss
eff. Effective Output Capacitance ––– 1280 ––
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units
I
S
Continuous Source Current ––– –––
200
(Body Diode) A
I
SM
Pulsed Source Current ––– ––– 790
(Body Diode)
V
SD
Diode Forward Voltage ––– ––– 1.3 V
t
rr
Reverse Recovery Time ––– 26 39 ns
Q
rr
Reverse Recovery Charge ––– 18 27 nC
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
V
DS
= 40V, V
GS
= 0V, T
J
= 125°C
MOSFET symbol
showing the
integral reverse
p-n junction diode.
V
GS
= 16V
V
GS
= -16V
V
DS
= 32V
Conditions
V
GS
= 5.0V
I
D
= 75A
V
GS
= 0V
V
DS
= 25V
T
J
= 25°C, I
S
= 75A , V
GS
= 0V
T
J
= 25°C, I
F
= 75A , V
DD
= 20V
di/dt = 100A/μs
Conditions
V
GS
= 0V, I
D
= 250μA
Reference to 25°C, I
D
= 1mA
V
GS
= 10V, I
D
= 75A
V
DS
= V
GS
, I
D
= 250μA
V
DS
= 40V, V
GS
= 0V
V
GS
= 4.5V, I
D
= 40A
V
GS
= 5.0V, I
D
= 40A
V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
V
GS
= 0V, V
DS
= 32V, ƒ = 1.0MHz
V
GS
= 0V, V
DS
= 0V to 32V
V
GS
= 5.0V
V
DD
= 20V
I
D
= 75A
R
G
= 4.0Ω
V
DS
= 10V, I
D
= 75A
ƒ = 1.0MHz
IRL1404Z/S/LPbF
www.irf.com 3
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Typical Forward Transconductance
vs. Drain Current
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
VGS
TOP 10V
7.0V
5.0V
4.5V
4.0V
3.5V
3.3V
BOTTOM 3.0V
60μs PULSE WIDTH
Tj = 25°C
3.0V
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
1
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
60μs PULSE WIDTH
Tj = 175°C
3.0V
VGS
TOP 10V
7.0V
5.0V
4.5V
4.0V
3.5V
3.3V
BOTTOM 3.0V
2 3 4 5 6 7 8 9 10
V
GS
, Gate-to-Source Voltage (V)
1.0
10
100
1000
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
Α
)
T
J
= 25°C
T
J
= 175°C
V
DS
= 10V
60μs PULSE WIDTH
0 50 100 150 200
I
D
,Drain-to-Source Current (A)
0
50
100
150
200
G
f
s
,
F
o
r
w
a
r
d
T
r
a
n
s
c
o
n
d
u
c
t
a
n
c
e
(
S
)
T
J
= 25°C
T
J
= 175°C
V
DS
= 10V

IRL1404ZSTRLPBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET MOSFT 40V 200A 3.1mOhm 75nC Log Lvl
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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