MC10H166FNR2

MC10H166
http://onsemi.com
4
A0
B0
A1
B1
A2
B2
A3
B3
A4
B4
B0
A1
B1
A2
B2
A3
B3
A4
B4
A0
B0
A1
B1
A2
B2
A3
B3
A4
B4
A
B
A
B
A B
A B
A
B
A B
FIGURE 2 25BIT MAGNITUDE COMPARATOR
For shorter delay times than possible with serial expansion,
devices can be cascaded. Figure 2 shows a 25bit cascaded
comparator whose worst case delay is two datatooutput delays.
The cascaded scheme can be extended to longer word lengths.
A = B
A < B
A > B
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
A < B
A > B
B24
A24
B23
A23
B22
A22
B21
A21
B20
A20
B19
A19
B18
A18
B17
A17
B16
A16
B15
A15
B14
A14
B13
A13
B12
A12
B11
A11
B10
A10
B9
A9
B8
A8
B7
A7
B6
A6
B5
A5
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
A < B
A > B
A0
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
A <
B
A > B
MC10H166
http://onsemi.com
5
ORDERING INFORMATION
Device Package Shipping
MC10H166FN PLLC20 46 Units / Rail
MC10H166FNG PLLC20
(PbFree)
46 Units / Rail
MC10H166FNR2 PLLC20 500 / Tape & Reel
MC10H166FNR2G PLLC20
(PbFree)
500 / Tape & Reel
MC10H166L CDIP16 25 Unit / Rail
MC10H166P PDIP16 25 Unit / Rail
MC10H166PG PDIP16
(PbFree)
25 Unit / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC10H166
http://onsemi.com
6
PACKAGE DIMENSIONS
M
N
L
Y BRK
W
V
D
D
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
S
0.010 (0.250) N
S
T
X
G1
B
U
Z
VIEW DD
20 1
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
S
0.010 (0.250) N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
T
SEATING
PLANE
S
L−M
M
0.007 (0.180) N
S
T
S
L−M
M
0.007 (0.180) N
S
T
H
VIEW S
K
K1
F
G1
20 LEAD PLLC
CASE 77502
ISSUE E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS L, M, AND N DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM T, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC 1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 −−− 0.51 −−−
K 0.025 −−− 0.64 −−−
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y −−− 0.020 −−− 0.50
Z 2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
____

MC10H166FNR2

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Logic Comparators 5V ECL 5-Bit
Lifecycle:
New from this manufacturer.
Delivery:
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