BAOOT / FP series
Regulator ICs
!
!!
!
Measurement circuits
V
22µF
0.33µF
IO
VCC
OUT
V
CC
GND
Fig. 1 Measurement circuit for output voltage,
input stability, load regulation,
temperature coefficient of output
voltage
V
V
22µF
0.33µF
100µF
e
in
e
IN
= 1V
rms
f = 120Hz
e
OUT
105W
V
CC
OUT
V
CC
GND
I
O
=
100mA
Ripple rejection ratio R.R. = 20 log
(
eIN
eOUT
)
Fig. 2 Measurement circuit for ripple rejection ratio
22µF
0.33µF
I
O
= 500mA
V
V
CC
= 0.95V
O
OUT
V
CC
GND
Fig. 3 Measurement circuit for minimum I/O voltage differential
22
µ
F
0.33µF
A
V
CC
OUT
V
CC
GND
Fig. 4 Measurement circuit for bias current
22µF
0.33µF
V
CC
I
OS
OUT
V
CC
GND
A
Fig. 5 Measurement circuit for
output short-circuit current
BAOOT / FP series
Regulator ICs
!
!!
!
Operation notes
(1) Operating power supply voltage
When operating within the normal voltage range and
within the ambient operating temperature range, most
circuit functions are guaranteed.
The rated values cannot be guaranteed for the electrical
characteristics, but there are no sudden changes of the
characteristics within these ranges.
(2) Power dissipation
Heat attenuation characteristics are noted on a separate
page and can be used as a guide in judging power
dissipation.
If these ICs are used in such a way that the allowable
power dissipation level is exceeded, an increase in the
chip temperature could cause a reduction in the current
capability or could otherwise adversely affect the
performance of the IC. Make sure a sufficient margin is
allowed so that the allowable power dissipation value is
not exceeded.
(3) Output oscillation prevention and bypass capacitor
Be sure to connect a capacitor between the output pin
and GND to prevent oscillation. Since fluctuations in the
valve of the capacitor due to temperature changes may
cause oscillations, a tantalum electrolytic capacitor with a
small internal series resistance (ESR) is recommended.
A 22
µ
F capacitor is recommended; however, be aware
that if an extremely large capacitance is used (1000
µ
F
or greater), then oscillations may occur at low
frequencies. Therefore, be sure to perform the
appropriate verifications before selecting the capacitor.
Also, we recommend connecting a 0.33
µ
F bypass
capacitor as close as possible between the input pin and
GND.
(4) Overcurrent protection circuit
An overcurrent protection circuit is built into the outputs,
to prevent destruction of the IC in the even the load is
shorted.
This protection circuit limits the current in the shape of
a ’7’. This circuit is designed with a high margin, so that
that current is restricted and latching is prevented, even if
a high-capacitance capacitator causes a large amount of
current to temporary flow through the IC.
However, these protection circuits are only good for pre-
venting damage from sudden accidents and should not
be used for continuous protection (for instance, clamping
at an output of 1V
F
or greater; below 1V
F
, the short mode
circuit operates). Note that the capacitor has negative
temperature characteristics, and the design should take
this into consideration.
(5) Thermal overload circuit
A built-in thermal overload circuit prevents damage from
overheating. When the thermal circuit is activated, the
outputs are turned OFF. When the temperature drops
back to a constant level, the circuit is restored.
(6) Internal circuits could be damaged if there are
modes in which the electric potential of the application’s
input (V
CC
) and GND are the opposite of the electric
potential normally used by each of the outputs. Use of a
diode or other such bypass path is recommended.
(7) Although the manufacture of this product includes
rigorous quality assurance procedures, the product may
be damaged if absolute maximum ratings for voltage or
operating temperature are exceeded. If damage has
occurred, special modes (such as short circuit mode or
open circuit mode) cannot be specified. If it is possible
that such special modes may be needed, please
consider using a fuse or some other mechanical safety
mea-sure.
(8) When used within a strong magnetic field, be aware
that the possibility of malfunction exists.
BAOOT / FP series
Regulator ICs
!
!!
!
Electrical characteristic curves
(Note) When Al thermal plate is used: Tightening torque: 6 (kg-cm) Apply silicon grease
25
20
15
10
5
0 25 50 75 100 125 150
(1) Infinite heat sink, θ j-c = 5.7 (
°C
/W)
(2) 100 × 100 × 2 (mm
3
), with Al heat sink
(3) 50 × 50 × 2 (mm
3
), with Al heat sink
(4) No heat sink θ j-a = 62.5 (
°C
/W)
POWER DISSIPATION : Pd (W)
(3) 6.5
(4) 2.0
AMBIENT TEMPERATURE : Ta (°C)
(1) 22.0
(2) 11.0
Fig.6 Ta - power dissipation
characteristics (TO220FP)
AMBIENT TEMPERATURE : Ta ( °C )
Fig. 7 Ta - power dissipation
characteristics
(TO 252-3)
0 25 50 75 100 125 150
2.5
5
7.5
10
12.5
0
POWER DISSIPATION : Pd (W)
(1) 10.0
(2) 1.0
(1) Infinite heat sink θ j-c=12.5 (°C/W)
(2) IC alone θ j-c=125.0 (°C/W)
OUTPUT VOLTAGE : V
OUT
(V)
JUNCTION TEMPERATURE : Tj (°C)
0
1
2
3
4
5
25 50 75 100 125 150 175 200
6
V
CC
= 10V I
OUT
= 0
BA05T
Fig. 8 Thermal cutoff circuit
characteristics
OUTPUT VOLTAGE : V
OUT
(V)
OUTPUT CURRENT : I
OUT
(A)
10
8
6
4
2
0
0 1.0 2.0
V
CC
= 10V
BA05T
Fig. 9 Current limit characteristics
OUTPUT VOLTAGE : V
OUT
(V)
INPUT VOLTAGE : V
CC
(V)
6
5
4
3
2
1
0
01020304050
BA05T
Fig. 10 Over voltage protection
characteristics
!
!!
!
External dimensions
(Units : mm)
TO220FP
2.54±0.5 2.54±0.5 2.6±0.5
1.3
0.8
1.8±0.2
8.0±0.2
5.0±0.2
12.0±0.2
13.5Min.
TO252-3
(1) (2) (3)
φ3.1±0.1
(1) V
CC
(2) GND
(3) OUT
10.0
+0.3
0.1
7.0
+0.3
0.1
17.0
+0.4
0.2
4.5
+0.3
0.1
2.8
+0.2
0.1
0.55
+0.1
0.05
BA BA
(1) V
CC
(2) GND
(3) OUT
7.0±0.3
6.5
±
0.2
213
0.8
0.65 0.65
2.3
±
0.2 2.3
±
0.2 0.5
±
0.1
1.5
2.5
9.5±0.5
2.3
±
0.2
0.5
±
0.1
5.0
0.1
+
0.2
5.5±0.2
FP Series
T Series

BA06T

Mfr. #:
Manufacturer:
ROHM Semiconductor
Description:
LDO Voltage Regulators LDO Reg Pos 6V 1A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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