SSL5015TE All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 2 — 26 February 2014 11 of 20
NXP Semiconductors
SSL5015TE
Compact non-dimmable LED driver IC
9. Limiting values
[1] The current into the VCC pin must not exceed the maximum I
DD
value.
[2] An internal clamp sets the supply voltage and current limits.
[3] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[4] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each
pin down to 0 V over a 1 resistor.
10. Thermal characteristics
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
General
SR slew rate on pin DRAIN 5+5V/ns
P
tot
total power dissipation - 1.6 W
T
amb
ambient temperature 40 +125 C
T
j
junction temperature 40 +150 C
T
stg
storage temperature 55 +150 C
Voltages
V
CC
supply voltage continuous
[1]
0.4 +19 V
V
DRAIN
voltage on pin DRAIN 0.4 +300 V
V
HV
voltage on pin HV current limited 0.4 +600 V
V
SOURCE
voltage on pin SOURCE current limited 0.4 +5.2 V
V
NTC
voltage on pin NTC current limited 0.4 +5.2 V
Currents
I
DD
supply current at pin VCC
[2]
-20mA
I
DRAIN
current on pin DRAIN 2+2A
I
SOURCE
current on pin SOURCE 2+2A
I
DVDT
current on pin DVDT duration 20 s
maximum
-1.3A
V
ESD
electrostatic discharge
voltage
human body model;
(for all pins except
DRAIN and HV)
[3]
2+2kV
human body model
for DRAIN and HV
1+1kV
charged device
[4]
500 +500 V
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-a)
thermal resistance from junction to ambient in free air; HSO8 package, PCB:
1.5 cm 14 cm, 2-layer, 35 m copper (Cu) per
layer; copper for IC: 12.7 cm
2
78.6 K/W
in free air; HSO8 package; PCB: JEDEC 2s2p 41.8 K/W
j-top
thermal characterization parameter from
junction to top of package
top package temperature measured at the
warmest point on top of the case; HSO8
package
5.2 K/W