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MF-NSHT035KX-2

P1-P3P4-P4
Features
n Compliant with AEC-Q200 Rev-C -
Stress Test Qualification for Passive
Components in Automotive Applications
n Small footprint size (1206)
n Operating temperature range up to 125 °C
n Low thermal derating factor
n Higher hold currents at elevated temperatures
n RoHS compliant*
MF-NSHT Series - PTC Resettable Fuses
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Environmental Characteristics
Operating Temperature ......................................... -40 °C to +125 °C
Passive Aging ....................................................... +125 °C, 1000 hours ............................................. R
nal
<R
1max.
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. R
nal
<R
1max.
Thermal Shock ..................................................... +125 °C to -40 °C, 20 times .................................. R
nal
<R
1max.
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change
Condition A
Moisture Sensitivity Level (MSL) .......................... Level 1
ESD Classication - HBM ..................................... Class 6
Electrical Characteristics
Model
V max.
Volts
I max.
Amps
I
hold
I
trip
Resistance
Max. Time
To Trip
Tripped
Power
Dissipation
Amperes
at 23 °C
Ohms
at 23 °C
Amperes
at 23 °C
Seconds
at 23 °C
Watts
at 23 °C
Hold Trip
R
Min.
R
1Max.**
Typ.
MF-NSHT016KX 30 20 0.16 0.80 0.7 6.0 8.0 0.1 0.9
MF-NSHT035KX 30 20 0.35 1.75 0.4 2.6 8.0 0.1 0.9
Test Procedures And Requirements For Model MF-NSHT Series
Test Test Conditions Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. R
min
≤ R ≤ R
1max
Time to Trip ........................................................... At specied current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at I
hold
..................................................... No trip
Trip Cycle Life ....................................................... V
max
, I
max
, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... V
max
, 48 hours ..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
Thermal Derating Chart - I
hold
(Amps)
Model
Ambient Operating Temperature
-40 °C -20 °C 0 °C +23 °C +40 °C +50 °C +60 °C +70 °C +85 °C +125 °C
MF-NSHT016KX 0.232 0.210 0.186 0.160 0.141 0.130 0.118 0.107 0.090 0.043
MF-NSHT035KX 0.508 0.459 0.406 0.350 0.308 0.284 0.259 0.235 0.196 0.095
**R
1Max.
measured 24 hours post reow.
Asia-Pacic: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 520 390 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
Applications
n Protection of automotive circuitry
including engine control modules
n Overcurrent surge protection of electronic
equipment required to operate at high
operating temperature ranges
n Resettable fault protection for general
electronic equipment
*RoHS COMPLIANT
*RoHS COMPLIANT
& AEC APPROVED
*RoHS COMPLIANT, **HALOGEN FREE
& AEC COMPLIANT
*RoHS and
AEC-Q200 COMPLIANT
LEAD FREE
*RoHS COMPLIANT
VERSIONS
AVAILABLE
LEAD FREE
VERSIONS ARE
RoHS COMPLIANT*
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-NSHT Series - PTC Resettable Fuses
Product Dimensions
DIMENSIONS:
MM
(INCHES)
Model
A B C D
Min. Max. Min. Max. Min. Max. Min.
MF-NSHT016KX
3.00
(0.118)
3.40
(0.134)
1.40
(0.055)
1.80
(0.071)
0.40
(0.016)
0.85
(0.033)
0.25
(0.010)
MF-NSHT035KX
3.00
(0.118)
3.40
(0.134)
1.40
(0.055)
1.80
(0.071)
0.40
(0.016)
0.85
(0.033)
0.25
(0.010)
Packaging: 3000 pcs. per reel.
Terminal material:
Nickel/gold plated.
Termination pad solderability:
Standard Au nish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
Typical Time to Trip at 23 ˚C
The Time to Trip curves represent typical performance of a device in a simulated application
environment. Actual performance in specic customer applications may differ from these values due
to the inuence of other variables.
How to Order
MF - NSHT 016 K X - 2
Multifuse
®
Product
Designator
Series
NSHT = 1206 High Temperature
Surface Mount
Component
Hold Current, I
hold
016 - 035 (0.16 - 0.35 Amps)
Material Specic Code
Multifuse
®
freeXpansion
™
Design
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Typical Part Marking
Represents total content. Layout may vary.
A
B
1.60 ± 0.10
(.063 ± .004)
C
Top View Bottom View Side View Recommended Pad Layout
D
D
2.00 ± 0.10
(.079 ± .004)
1.00 ± 0.05
(.039 ± .002)
PART IDENTIFICATION:
MF-NSHT016KX = D
MF-NSHT035KX = F
BIWEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL:
WEEK 1 AND 2 = A
WEEK 51 AND 52 = Z
D
1
0.01
0.1
0.001
0.0001
100.1 1 100
Fault Current (Amps)
Time to Trip (Seconds)
MF-NSHT035KX
MF-NSHT016KX
DIMENSIONS:
MM
(INCHES)
“freeXpansion Design” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-NSHT Series - PTC Resettable Fuses
MF-NSHT SERIES, REV. C 05/18
Solder Reow Recommendations
Notes:
• MF-NSHT models cannot be wave soldered or hand soldered. Please
contact Bourns for soldering recommendations.
• All temperatures refer to topside of the package, measured on the
package body surface.
• If reow temperatures exceed the recommended prole, devices may
not meet the published specications.
• Compatible with Pb and Pb-free solder reow proles.
• Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse
®
Polymer PTC Soldering
Recommendation guidelines.
• Designed for single solder reow operations.
Temperature of Lead/Pad Junction
Process
Materials Temperature
Time
Description Interval
1. Apply solder paste to • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature
test board (8 - 10 mil thick) Alloy water soluble or no
clean solder paste
(see note 1)
• single sided epoxy glass
(G10) (UL approved)
• PC board approx. 4x4x.06 in.
2. Place test units onto board 6 units/board
3. Ramp up Convection oven (see note 2) 2.5 °C ± 0.5 °/sec.
4. Preheat (T
S
.ces03±09C°091otC°051)
5. Time above liquidus (T
L
.ces09-06C°022)
6. Peak temperature (T
P
°5-/°0+C°052)
10-20 sec. within
5 °C of peak
.ces/C°5.0±C°3erutarepmetmooRnwodpmaR.7
(see note 2)
8. Cleaning water clean profile High pressure deionized 72 °F to 160 °F As required
water 65 PSI max. (22 °C to 71 °C)
Inspect solder joint to determine if solder joint is
acceptable (i.e. exhibits wetting of joint’s surface).
Use the following criteria (ref. acceptability of printed
board assemblies, IPC-A-610):
A) Acceptable (see Figure 1)
(1) The solder connection wetting angle (solder to
component and solder to PCB termination)
does not exceed 90 °.
(2) Solder balls that do not violate minimum
electrical clearances and are attached
(soldered) to a metal surface.
B) Unacceptable (see Figure 2)
(1) Solder connection wetting angle exceeding
90 °.
(2) Incomplete reflow of solder paste.
(3) Dewetting.
If unacceptable, determine cause and correct prior to
next run.
NOTES:
1. Water soluble solder paste only above 100K.
2. Refer to ref. temperature profile. Temperature at
lead/pad junction with “K” type thermocouple.
3. Units that are board mounted for environmental
testing must see a peak temperature in the reflow
zone, as specified. This is to ensure that all test
units will see “worst case conditions”.
4. Ramp down rate to be measured from 245 °C to
150 °C.
5. Process Description 8 does not apply to open
frame trimmers.
(Derived using 6-zone Convection Oven)
T
P
T
P
t
p
t
s
TTO
RAMP-UP
L
T
L
t
L
T MAX.
S
T MIN.
25
PREHEAT
S
Temperature
Time
CRITICAL ZONE
RAMP-DOWN
8 MINS.
t 25 *C TO PEAK
Prole Feature Pb-Free Assembly
Average Ramp-Up Rate (TS
max
to T
p
) 3 °C / second max.
PREHEAT:
Temperature Min. (TS
min
)
Temperature Max. (TS
max
)
Time (ts
min
to ts
max
)
150 °C
200 °C
60~180 seconds
TIME MAINTAINED ABOVE:
Temperature (T
L
)
Time (t
L
)
217 °C
60~150 seconds
Peak / Classication Temperature (T
P
) 260 °C
Time within 5 °C of Actual Peak Temperature (t
p
) 20~40 seconds
Ramp-Down Rate 6 °C / second max.
Time within 25 °C to Peak Temperature 8 minutes max.
P1-P3P4-P4

MF-NSHT035KX-2

Mfr. #:
Buy MF-NSHT035KX-2
Manufacturer:
Bourns
Description:
Resettable Fuses - PPTC 30V 80A .35A AEC-Q200 1206
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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