Input/Output Capacitance
The lump capacitance values are not listed. Simulations should use actual models and
not lumped capacitance.
Temperature and Thermal Impedance
It is imperative that the DDR3L SDRAM device’s temperature specifications, shown in
the following table, be maintained in order to ensure the junction temperature is in the
proper operating range to meet data sheet specifications. An important step in main-
taining the proper junction temperature is using the device’s thermal impedances cor-
rectly. Thermal impedances listed in the Thermal Characteristics table apply to the cur-
rent die revision and packages.
Incorrectly using thermal impedances can produce significant errors. Read Micron
technical note TN-00-08, “Thermal Applications,” prior to using the values listed in the
thermal impedance table. For designs that are expected to last several years and require
the flexibility to use several DRAM die shrinks, consider using final target theta values
(rather than existing values) to account for increased thermal impedances from the die
size reduction.
The DDR3 SDRAM device’s safe junction temperature range can be maintained when
the T
C
specification is not exceeded. In applications where the device’s ambient tem-
perature is too high, use of forced air and/or heat sinks may be required to satisfy the
case temperature specifications.
Table 5: Thermal Characteristics
Notes 1–3 apply to entire table
Parameter Symbol Value Units Notes
Operating temperature T
C
0 to 85 °C
0 to 95 °C 4
Notes:
1. MAX operating case temperature T
C
is measured in the center of the package, as shown
below.
2. A thermal solution must be designed to ensure that the device does not exceed the
maximum T
C
during operation.
3. Device functionality is not guaranteed if the device exceeds maximum T
C
during
operation.
4. If T
C
exceeds 85°C, the DRAM must be refreshed externally at 2x refresh, which is a 3.9µs
interval refresh rate. The use of self refresh temperature (SRT) or automatic self refresh
(ASR), if available, must be enabled.
8Gb: x16 TwinDie DDR3L SDRAM
Electrical Specifications
PDF: 09005aef84ccb467
DDR3L_8Gb_x16_2CS_TwinDie.pdf - Rev. D 10/13 EN
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2012 Micron Technology, Inc. All rights reserved.