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CPC1014NTR

P1-P3P4-P6
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R05
CPC1014N
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifi cations, please contact our application department.
PERFORMANCE DATA*
Turn-On Time (ms)
-40
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-20 0 20 40 60 80 100
Temperature (ºC)
I
F
=5mA
I
F
=10mA
Turn-On Time vs. Temperature
(I
L
=80mA)
Turn-Off Time (ms)
-40
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
-20 0 20 40 60 80 100
Turn-Off Time vs. Temperature
(I
L
=80mA)
Temperature (ºC)
I
F
=5mA
I
F
=10mA
-40
0.9
0.8
0.7
0.6
0.5
0.4
0.3
-20 0 20 40 60 80 100
Steady State
On-Resistance (:)
Temperature (ºC)
I
F
=5mA
I
F
=10mA
Typical On-Resistance vs. Temperature
(I
L
=200mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.16
0.20
0.24
0.28
0.32
0.36
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=200mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.28
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=200mA)
0.36
0.24
0.20
0.16
0.32
Load Voltage (V)
-0.3 -0.2 -0.1 0.0 0.1 0.2 0.3
Load Current (mA)
-500
-400
-300
-200
-100
0
100
200
300
400
500
Typical Load Current vs. Load Voltage
(I
F
=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
0
100
200
300
400
500
Maximum Load Current vs. Temperature
(I
F
=2mA)
Blocking Voltage (V
P
)
-40
72
70
68
66
64
62
60
58
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Leakage (µA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(V
L
=60V)
Temperature (ºC)
Load Voltage (V)
0 1020304050
Output Capacitance (pF)
0
25
50
75
100
125
150
175
200
Output Capacitance vs. Load Voltage
(I
F
=0mA, f=1MHz)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (mA)
0
100
200
300
400
500
600
700
800
900
1000
1100
Energy Rating Curve
(I
F
=2mA)
I
NTEGRATED
C
IRCUITS
D
IVISION
CPC1014N
www.ixysic.com
5
R05
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1014N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (T
C
) of this product and the maximum dwell time the
body temperature of this device may be (T
C
- 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (T
c
) Dwell Time (t
p
) Max Refl ow Cycles
CPC1014N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
I
NTEGRATED
C
IRCUITS
D
IVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1014N-R05
©Copyright 2016, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/25/2016
For additional information please visit our website at: www.ixysic.com
6
CPC1014N
MECHANICAL DIMENSIONS
Recommended PCB Land Pattern
2.54
(0.10)
5.60
(0.2205)
1.30
(0.0512)
0.60
(0.0217)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.203
(0.161 ± 0.008)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003)
0.432 ± 0.127
(0.017 ± 0.005)
0.200 ± 0.025
(0.008 ± 0.001)
1.02 ± 0.025
(0.040 ± 0.001)
2.184 Max
(0.086 Max)
0.381 TYP.
(0.015 TYP.)
Pin to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction of Feed
User Direction of Feed
K
0
=2.70
(0.106)
K
1
=2.30
(0.091)
B
0
=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A
0
=6.50
(0.256)
CPC1014N
CPC1014NTR Tape & Reel
P1-P3P4-P6

CPC1014NTR

Mfr. #:
Buy CPC1014NTR
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount 1-Form-A 60V 400mA Solid State Relay
Lifecycle:
New from this manufacturer.
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