INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
Features
4/14/04
• Low VCE (on) Non Punch Through IGBT Technology.
• Low Diode VF.
• 10µs Short Circuit Capability.
• Square RBSOA.
• Ultrasoft Diode Reverse Recovery Characteristics.
• Positive VCE (on) Temperature Coefficient.
Benefits
www.irf.com 1
• Benchmark Efficiency for Motor Control.
• Rugged Transient Performance.
• Low EMI.
• Excellent Current Sharing in Parallel Operation.
IRGIB6B60KD
E
G
n-channel
C
V
CES
= 600V
I
C
= 6.0A, T
C
=90°C
t
sc
> 10µs, T
J
=175°C
V
CE(on)
typ. = 1.8V
TO-220
Full-Pak
Absolute Maximum Ratings
Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 600 V
I
C
@ T
C
= 25°C Continuous Collector Current 11
I
C
@ T
C
= 100°C Continuous Collector Current 7.0 A
I
CM
Pulse Collector Current (Ref.Fig.C.T.5) 22
I
LM
Clamped Inductive Load current
22
I
F
@ T
C
= 25°C Diode Continuous Forward Current 9.0
I
F
@ T
C
= 100°C Diode Continuous Forward Current 6.0
I
FM
Diode Maximum Forward Current 18
V
ISOL
RMS Isolation Voltage, Terminal to Case, t = 1 min 2500 V
V
GE
Gate-to-Emitter Voltage ±20
P
D
@ T
C
= 25°C Maximum Power Dissipation 38 W
P
D
@ T
C
= 100°C Maximum Power Dissipation 19
T
J
Operating Junction and -55 to +175
T
STG
Storage Temperature Range °C
Soldering Temperature for 10 sec. 300 (0.063 in. (1.6mm) from case)
Mounting Torque, 6-32 or M3 Screw 10 lbf.in (1.1N.m)
Thermal / Mechanical Characteristics
Parameter Min. Typ. Max. Units
R
θJC
Junction-to-Case- IGBT ––– ––– 3.9
R
θJC
Junction-to-Case- Diode ––– ––– 6.0 °C/W
R
θCS
Case-to-Sink, flat, greased surface ––– 0.50 –––
R
θJA
Junction-to-Ambient, typical socket mount ––– ––– 62
Wt Weight –– 2.0 ––– g
PD-94427D
IRGIB6B60KD
2 www.irf.com
Vcc =80% (V
CES
), V
GE
= 20V, L =100µH, R
G
= 50Ω.
Energy losses include "tail" and diode reverse recovery.
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions Ref.Fig.
V
(BR)CES
Collector-to-Emitter Breakdown Voltage 600 V
V
GE
= 0V, I
C
= 500µA
V
(BR)CES
/
T
J
Temperature Coeff. of Breakdown Volta
g
e —0.30—V/°C
V
GE
= 0V, I
C
= 1mA (25°C-150°C)
V
CE(on)
Collector-to-Emitter Voltage 1.50 1.80 2.20 V
I
C
= 5A, V
GE
= 15V, T
J
= 25°C
5,6,7
—2.202.50
I
C
= 5A, V
GE
= 15V, T
J
= 150°C
—2.302.60
I
C
= 5A, V
GE
= 15V, T
J
= 175°C
9,10,11
V
GE(th)
Gate Threshold Voltage 3.5 4.5 5.5 V
V
CE
= V
GE
, I
C
= 250µA
9,10,11
V
GE(th)
/
T
J
Threshold Voltage temp. coefficient -10 mV/°
C
V
CE
= V
GE
, I
C
= 1mA (25°C-150°C)
12
gfe Forward Transconductance 3.0 S
V
CE
= 50V, I
C
= 5.0A, PW = 80µs
I
CES
Zero Gate Voltage Collector Current 1.0 150 µA
V
GE
= 0V, V
CE
= 600V
—200500
V
GE
= 0V, V
CE
= 600V, T
J
= 150°C
720 1100
V
GE
= 0V, V
CE
= 600V, T
J
= 175°C
V
FM
Diode Forward Voltage Drop 1.25 1.45 V
I
F
= 5.0A, V
GE
= 0V
8
—1.201.40
I
F
= 5.0A, V
GE
= 0V, T
J
= 150°C
—1.151.35
I
F
= 5.0A, V
GE
= 0V, T
J
= 175°C
I
GES
Gate-to-Emitter Leakage Current ±100 nA
V
GE
= ±20V, V
CE
= 0V
Switching Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
Ref.Fig.
Q
g
Total Gate Charge (turn-on) 18.2 27.3
I
C
= 5.0A
23
Q
ge
Gate-to-Emitter Charge (turn-on) 1.9 2.85 nC
V
CC
= 400V
CT1
Q
gc
Gate-to-Collector Charge (turn-on) 9.2 13.8
V
GE
= 15V
E
on
Turn-On Switching Loss 110 210
I
C
= 5.0A, V
CC
= 400V
CT4
E
off
Turn-Off Switching Loss 135 245 µJ
V
GE
= 15V, R
G
= 100, L = 1.4mH
E
tot
Total Switching Loss 245 455
Ls= 150nH, T
J
= 25°C
t
d(on)
Turn-On delay time 25 34
I
C
= 5.0A, V
CC
= 400V
t
r
Rise time 17 26 ns
V
GE
= 15V, R
G
= 100
, L = 1.4mH
CT4
t
d(off)
Turn-Off delay time 215 230
Ls= 150nH, T
J
= 25°C
t
f
Fall time 13.2 22
E
on
Turn-On Switching Loss 150 260
I
C
= 5.0A, V
CC
= 400V
CT4
E
off
Turn-Off Switching Loss 190 300 µJ
V
GE
= 15V, R
G
= 100, L = 1.4mH
13,15
E
tot
Total Switching Loss 340 560
Ls= 150nH, T
J
= 150°C
WF1,WF2
t
d(on)
Turn-On delay time 28 37
I
C
= 5.0A, V
CC
= 400V
14,16
t
r
Rise time 17 26 ns
V
GE
= 15V, R
G
= 100
, L = 1.4mH
CT4
t
d(off)
Turn-Off delay time 240 255
Ls= 150nH, T
J
= 150°C
WF1
t
f
Fall time 18 27 WF2
L
E
Internal Emitter Inductance 7.5 nH Measured 5 mm from package
C
ies
Input Capacitance 290 435
V
GE
= 0V
C
oes
Output Capacitance 34 51 pF
V
CC
= 30V
22
C
res
Reverse Transfer Capacitance 10 15 f = 1.0MHz
RBSOA Reverse Bias Safe Operating Area FULL SQUARE
T
J
= 150°C, I
C
= 18A, Vp = 600V
4
V
CC
=500V,V
GE
= +15V to 0V,R
G
= 100
CT2
SCSOA Short Circuit Safe Operating Area 10 µs
T
J
= 150°C, Vp = 600V, R
G
= 100
CT3
V
CC
=360V,V
GE
= +15V to 0V
WF4
I
SC (PEAK)
Peak Short Circuit Collector Current 50 A WF4
E
rec
Reverse Recovery Energy of the Diode 90 175 µJ
T
J
= 150°C
17,18,19
t
rr
Diode Reverse Recovery Time 70 91 ns
V
CC
= 400V, I
F
= 5.0A, L = 1.4mH 20,21
I
rr
Peak Reverse Recovery Current 10 13 A
V
GE
= 15V, R
G
= 100Ω, Ls= 150nH CT4,WF3
Q
rr
Diode Reverse Recovery Charge 350 455 nC di/dt = 400A/µs
IRGIB6B60KD
www.irf.com 3
Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
Fig. 2 - Power Dissipation vs. Case
Temperature
Fig. 3 - Forward SOA
T
C
= 25°C; T
J
175°C
Fig. 4 - Reverse Bias SOA
T
J
= 175°C; V
GE
=15V
0 20 40 60 80 100 120 140 160 180
T
C
(°C)
0
2
4
6
8
10
12
I
C
(
A
)
10 100 1000
V
CE
(V)
1
10
100
I
C
A
)
1 10 100 1000 10000
V
CE
(V)
0.01
0.1
1
10
100
I
C
(
A
)
10 µs
100 µs
1ms
DC
0 20 40 60 80 100 120 140 160 180
T
C
(°C)
0
5
10
15
20
25
30
35
40
P
t
o
t
(
W
)

IRGIB6B60KD116P

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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