CMB02070X3309GB200 Datasheet CMB02070X6800GB200, CMB02070X4700GB200, CMB02070X1000GB200 | P7-P9

CMB 0207

www.vishay.com

Vishay Beyschlag

Revision: 11-Feb-16

Document Number: 28755

For technical questions, contact: melf@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

TEST PROCEDURES AND REQUIREMENTS

60 115-1

CLAUSE

IEC

60 068-2

(1)

TEST

METHOD

TEST PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (R)

Stability for product types:

CMB 0207 2.2  to 1.5 M

4.5 - Resistance - ± 5 % R; ± 2 % R; ± 1 % R

4.8 - Temperature coefficient

At (20 / -55 / 20) °C

and (20 / 125 / 20) °C

see Temperature Coefficient graph

4.25.1

Endurance at 70 °C:

standard operation mode

U = U

max.

;

whichever is the less severe;

1.5 h on; 0.5 h off;

70 °C; 1000 h ± (1 % R + 0.05)

70 C; 8000 h ± (2 % R + 0.05)

Endurance at 70 C:

power operation mode

U = U

max.

;

whichever is the less severe;

1.5 h on; 0.5 h off;

70 °C; 1000 h ± (2 % R + 0.05)

70 C; 8000 h ± (4 % R + 0.05)

4.25.3 -

Endurance at upper category

temperature

125 °C; 1000 h ± (2 % R + 0.05)

155 °C; 1000 h ± (4 % R + 0.05)

4.24 78 (Cab) Damp heat, steady state (40 ± 2C; 56 days; (93 ± 3) % RH ± (1 % R + 0.1 )

4.37 67 (Cy)

Damp heat,

steady state,

accelerated

(85 ± 2) °C

(85 ± 5) % RH

U =  100 V

and U = 0.3 x U

max.

;

(the smaller value is valid)

1000 h

± (2 % R + 0.1 )

4.23 Climatic sequence:

4.23.2 2 (Ba) dry heat UCT; 16 h

4.23.3 30 (Db) damp heat, cyclic 55 C; 24 h; 90 % RH; 1 cycle

4.23.4 1 (Aa) cold LCT; 2 h

4.23.5 13 (M) low air pressure 8.5 kPa; 2 h; (25 ± 10) C

4.23.6 30 (Db) damp heat, cyclic 55 C; 24 h; 90 % RH; 5 cycles

4.23.7 - DC load U = U

max.

; 1 min

LCT = -55 C; UCT = 155 °C ± (1 % R + 0.1 )

- 1 (Aa) Cold -55 C; 2 h ± (0.5 % R + 0.1)

4.19 14 (Na) Rapid change of temperature

30 min at LCT;

30 min at UCT;

LCT = -55 °C; UCT = 125 °C

5 cycles ± (0.5 % R + 0.1 )

1000 cycles ± (1.5 % R + 0.1 )

4.13 -

Short time overload;

standard operation mode

U = 2.5 x  2 x U

max.

;

whichever is the less severe;

5 s

± (0.25 % R + 0.1 )

Short time overload;

power operation mode

U = 2.5 x  2 x U

max.

;

whichever is the less severe;

5 s

± (0.5 % R + 0.1 )

4.22 6 (Fc) Vibration

Endurance by sweeping;

10 Hz to 2000 Hz;

no resonance;

amplitude  1.5 mm or

200 m/s

; 7.5 h

± (0.25 % R + 0.1)

x R

0.3 x P

x R

CMB 0207

www.vishay.com

Vishay Beyschlag

Revision: 11-Feb-16

Document Number: 28755

For technical questions, contact: melf@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Note

(1)

The quoted IEC standards are also released as EN standards with the same number and identical contents.

4.40 -

Electrostatic discharge

(human body model)

IEC 61340-3-1

(1)

;

3 pos. + 3 neg.

(equivalent to MIL-STD-883,

method 3015)

CMB 0207: 16 kV

± (0.5 % R + 0.05 )

4.17 58 (Td) Solderability

Solder bath method;

SnPb40;

non-activated flux;

(215

±3) °C; (3 ± 0.3) s

Good tinning ( 95 % covered);

no visible damage

Solder bath method;

SnAg3Cu0.5 or

SnAg3.5; non-activated flux;

(235

± 3) °C; (2 ±0.2) s

Good tinning ( 95 % covered);

no visible damage

4.18 58 (Td) Resistance to soldering heat

Solder bath method;

(260 ± 5)

C; (10 ± 1) s

± (0.5 % R + 0.1 )

Reflow method 2

(IR / forced gas convection);

(260 ± 5) °C; (10 ± 1) s

± (0.25 % R + 0.1 )

4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage

4.30 45 (XA) Solvent resistance of marking

Isopropyl alcohol; 50 C; method 1,

toothbrush

Marking legible;

no visible damage

4.32 21 (Ue

) Shear (adhesion) 45 N No visible damage

4.33 21 (Ue

) Substrate bending Depth 2 mm, 3 times

No visible damage;

no open circuit in bent position

± (0.5 % R + 0.1)

4.7 - Voltage proof U

RMS

= U

ins

; 60 s No flashover or breakdown

4.35 - Flammability

IEC 60695-11-5

(1)

needle flame test;

No burning after 30 s

TEST PROCEDURES AND REQUIREMENTS

60 115-1

CLAUSE

IEC

60 068-2

(1)

TEST

METHOD

TEST PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (R)

Stability for product types:

CMB 0207 2.2  to 1.5 M

CMB 0207

www.vishay.com

Vishay Beyschlag

Revision: 11-Feb-16

Document Number: 28755

For technical questions, contact: melf@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DIMENSIONS

Note

• Color code marking is applied according to IEC 60062

(1)

in four bands (E24 series) or five bands (E96 series). Each color band appears as

a single solid line, voids are permissible if at least

of the band is visible from each radial angle of view. The last color band for tolerance

is approximately 50 % wider than the other bands. An interrupted brown band between the 2

and 3

full band indicates the special carbon

film type.

PATTERN STYLES FOR MELF RESISTORS

Notes

• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of

power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain

the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which to a great extend depend

onboard materials and design. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g.

in standards IEC 61188-5-x

(1)

, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are

also strongly influenced by many other parameters.



Still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to “standard operation

mode”. Please note however that applications for “power operation mode” require special considerations for the design of solder pads and

adjacent conductor areas.



(1)

The quoted IEC standards are also released as EN standards with the same number and identical contents.

DIMENSIONS AND MASS

TYPE / SIZE

(mm)

MIN.

(mm)

MASS

(mg)

CMB 0207 5.8 + 0/- 0.15 2.2 + 0/- 0.2 3.2 D + 0/- 0.2 1.1 ± 0.1 79

RECOMMENDED SOLDER PAD DIMENSIONS

TYPE / SIZE

WAVE SOLDERING REFLOW SOLDERING

(mm)

CMB 0207 2.8 2.1 2.6 7.0 3.2 1.7 2.4 6.6

P1-P3 P4-P6 P7-P9 P10-P11

CMB02070X3309GB200

Mfr. #:

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Manufacturer:

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Description:

MELF Resistors 0.4W 33ohms 2% 0207 MELF 500V

Lifecycle:

New from this manufacturer.

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CMB02070X3309GB200

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