SQJ403BEEP
www.vishay.com
Vishay Siliconix
S16-1461-Rev. A, 19-Jul-16
1
Document Number: 67407
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Automotive P-Channel 30 V (D-S) 175 °C MOSFET
FEATURES
• TrenchFET
®
power MOSFET
• ESD protection: 3000 V
• AEC-Q101 qualified
• 100 % R
g
and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Notes
a. Package limited.
b. Pulse test; pulse width 300 μs, duty cycle 2 %.
c. When mounted on 1" square PCB (FR4 material).
d. See solder profile (www.vishay.com/doc?73257
). The end of the lead terminal of PowerPAK SO-8L is exposed copper (not plated) as a result
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure
adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
PRODUCT SUMMARY
V
DS
(V) -30
R
DS(on)
() at V
GS
= -10 V 0.0085
R
DS(on)
() at V
GS
= -4.5 V 0.0200
I
D
(A) -30
a
Configuration Single
Package PowerPAK SO-8L
PowerPAK
®
SO-8L Single
2
S
3
S
4
G
1
S
D
Bottom View
1
6.15 mm
5.13 mm
Top View
P-Channel
D
S
G
5400 Ω
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
-30
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current
a
T
C
= 25 °C
I
D
-30
A
T
C
= 125 °C -30
Continuous Source Current (Diode conduction)
a
I
S
-30
Pulsed Drain Current
b
I
DM
-84
Single Pulse Avalanche Current
L = 10 mH
I
AS
-6.5
Single Pulse Avalanche Energy E
AS
211 mJ
Maximum Power Dissipation
b
T
C
= 25 °C
P
D
68
W
T
C
= 125 °C 22
Operating Junction and Storage Temperature Range T
J
, T
stg
-55 to +175
°C
Soldering Recommendations (Peak temperature)
d, e
260
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL LIMIT UNIT
Junction-to-Ambient PCB mount
c
R
thJA
68
°C/W
Junction-to-Case (Drain) R
thJC
2.2