RECOMMENDED SOLDERING CONDITIONS
INFRARED RAY REFLOW TEMPERATURE PROFILE
(1) Infrared reflow soldering
• Peak reflow temperature
235 ˚C or below (plastic surface temperature)
• Reflow time
30 seconds or less (Time period during which the plastic surface temperature
is higher than 210 ºC
• Number of reflows Processes
Three
• Flux
Rosin flux containing small amount of chlorine (The flux
with a max. chlorine content of 0.2 Wt % is recommended.)
(2) Dip soldering
• Temperature
260 ˚C or below (molten solder temperature)
• Time
10 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux
with a max. chlorine content of 0.2 Wt % is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based
cleaning solvent.
Time (s)
Package Surface Temperature T (˚C)
100 to 160
˚
C
60 to 120 s
(preheating)
(heating)
to 10 s
to 30 s
235
˚
C (peak temperature)
210
˚
C
PS9613, PS9613L
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC Com
ound Semiconductor Devices, Ltd
10/14/2003
