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SLI-570DT3F

P1-P3P4-P6P7-P9P10-P12
　　　　
[Data Sheet]
■Part No. Construction
[SLI-570x/SLA-570x series]
*"-"will be taken out for emitting color Special Code will be applied for Chromaticity rank Rank sign
WB/B/E series. Emitting color WB/B/E series. (for white LED） (Brightness Rank)*
Series name Package type Emitting Color Resin Color Taping Specification
V R
U U
U2 Y
D G
Y C
Y2 RC
M T
P
E
B
*Concerning the Brightness rank.
WB
*Please refer to the rank chart above for
luminous intensity classification.
*Part name is individual for each rank.
*When shipped as sample,the part name will
be a representative part name.
General products are free of ranks.
Please contact sales if rank appointment
is needed.
White
SLD
1-Die Oval Type High Brightness LED Lamps
Yellowish green
Transparent Coloreless
Green
Green
Blue
SLR 1-Die Circular Type LED Lamps Red
<Yellow>DiffusedColored
Orange
<Yellowish green>DiffusedColored
SLA
1-Die Circular Type High Brightness LED Lamps
Red
<Red>DiffusedColored
SLI
1-Die Circular Type Low Current High Brightness LED Lamps
Red
<Orange>DiffusedColored
See Taping specifications
Yellow
Transparent Colored
Yellow
XS
3F
T□□
T
1-Element straight bulk
230 U 2 T7S L I － 5
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www.rohm.com
©2016 ROHM Co., Ltd. All rights reserved
7/10
2017.9 - Rev.004
　　　　
[Data Sheet]
Visual light emitting diode does not contain reinforcement materials such as glass fillers.
Therefore if sudden thermal and mechanical shock are given, destruction or inferiority of luminous
intensity may occur. Please take care of the handling.
　(3) Please process before soldering.
３． ASSEMBLY ON PC BOARD
　(1) In case of soldering on PCB, If the operation is done with stress, it may cause non-lighting
Please consult with us if any problems in the evaluation stage.
　(1) In case of termination processing, please fix the
　　termination
　(2) Processing position, and process the reverse side
　　of LED body.
　　If stress is given during processing, It may cause
　　non-lighting failure.
[SLI-570x/SLA-570x series]
■ATTENTION POINTS IN HANDLING
　　failure during soldering or using. Please design the through-holes of PCB suitable for lead pins
　　space or lead pins space after forming to avoid the physical stress on resin.
　(2) Using spacer between LEDʼs body and PCB is recommended.
　　In case of direct mount on PCB(SLR/SLI-343 series), please take care about clinch of LED pins
　　to avoid the remained stress and solder heat stress.
　　
Enough evaluation is requested before deciding assembly and soldering conditions.
■FIXATION METHOD
１．ATTENTION POINTS
　(1) Please do not give excessive heat over storage temperature to resin.
　　In case that the product has to be heated in oven for the glue fixing of surface mount parts,
　　this LED should be mounted after the glue fixing.
　(2) Please avoid stress to resin at high temperature.
２． TERMINATION PROCESSING
＜Good＞ ＜No good＞
To be fixed To be fixed
＜Good＞ ＜No good＞＜Good＞
＜2 lead pins type＞
＜3 lead pins type＞
Min.15°
Min.45°
Die bonding side
＜2 lead pin type＞
Min.15°
Min.45°
Die bonding side
Min.45
＜3 lead pin type＞
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www.rohm.com
©2016 ROHM Co., Ltd. All rights reserved
8/10
2017.9 - Rev.004
　　　　
[Data Sheet]
　(3) In case of double peak flow soldering, the temperature gap during 1st and 2nd soldering to be
　　less than 100 degree C.
CONDITIONS
5〜30℃
■ATTENTION ON STORAGING
In case of double peak flow soldering, the operation
time is counted from the beginning of 1st peak
to the end of 2nd peak.
５．CLEANING
　In case of cleaning, some solvents may cause damage of resin or cause non-lighting failure,
　so please check the solvent before actual use.
　(1) Lead pins may corrode if it is stored in the environment of high temperature and humidity
　　and lead to defective soldering.
　(2) In case of soldering after LEDʼs body absorb moisture highly, destruction or inferiority of
６．RECOMMENDABLE ROUND PATTERN
　　Round pattern depends on the material PCB, density and circuit arrangement.
Cleaning by solvent
Cleaning by solvent
Cleaning time
：Max. 3min
Max. 265℃ 5sec Max.
Soldering Iron
Max. 400℃
3sec Max.
Humidity
Expiration Date
Immersion time
：Max. 3min
Ultrasonic out
：Max. 15W/Liter
ARTICLE
Temperature
　　Our recommendation is as follow :
　Storage in dry box is most desirable, but if it is not possible, we recommend following conditions.
＜RECOMMENDABLE STORAGE CONDITIONS＞
The iron should not touch the LEDʼs body.
　The recommendable cleaning solvent is alcoholic one such as isopropyl alcohol.
＜RECOMMENDABLE CLEANING CONDITIONS＞
＜Recommendable soldering conditions＞
ARTIICLE
SOLDERINGTEMP
OPERATION TIME
Soldering Dip
Soldering Bath
[SLI-570x/SLA-570x series]
Temperature of solvent
：Max. 45℃
４．SOLDERING（Sn-3Ag-0.5Cu）
　(1) Please make soldering rapidly under the following temperature and time conditions.
　(2) Please avoid stress to LED lamp during soldering.
METHOD
CONDITIONS
－
Remarks
Pre-heat
Max. 100℃
60sec Max.
Max.60%RH
Within 1 year
Poor storage conditions may cause some failure as bellow.
　　luminous intensity may occur.
<2 lead pin type> <3 lead pin type/2.5mm pitch>
＜3 lead pin type/2.0mm pitch>
1.5
±0.1
1.0
2.0
2.0
φ2.0
2.0
2.5
or
5.0
±0.1
1.0
2.0
±0.1
1.0
2.5
2.5
＊Unit : mm
＊Lead types : □0.4mm
□0.5mm
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www.rohm.com
©2016 ROHM Co., Ltd. All rights reserved
9/10
2017.9 - Rev.004
P1-P3P4-P6P7-P9P10-P12

SLI-570DT3F

Mfr. #:
Buy SLI-570DT3F
Manufacturer:
ROHM Semiconductor
Description:
Standard LEDs - Through Hole ORANGE HIGH BRIGHT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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