— 12 —
No. Process Condition
2 Circuit design
Caution
2)
3)
Even below the rated voltage, if repetitive high frequency AC or pulse is applied,
the reliability of the capacitors may be reduced.
The effective capacitance will vary depending on applied DC and AC voltages.
The capacitors should be selected and designed in taking the voltages into
consideration.
2-3. Frequency
When the capacitors (Class 2) are used in AC and/or pulse voltages, the
capacitors may vibrate themselves and generate audible sound.
3 Designing
P.C.board
The amount of solder at the terminations has a direct effect on the reliability of the
capacitors.
1)
2)
3)
The greater the amount of solder, the higher the stress on the chip capacitors, and
the more likely that it will break. When designing a P.C.board, determine the
shape and size of the solder lands to have proper amount of solder on the
terminations.
Avoid using common solder land for multiple terminations and provide individual
solder land for each terminations.
Size and recommended land dimensions.
(mm)
Type
Symbol
CKCM25 CKCL22
A 0.45 – 0.55 0.55 – 0.65
B 0.45 – 0.55 0.55 – 0.65
C 0.31 – 0.41 0.40 – 0.50
P 0.59 – 0.69 0.95 -1.05
Solder land
C
P
A
B
— 13 —
No. Process Condition
3 Designing
P.C.board
4) Recommended chip capacitors layout is as following.
Disadvantage against
bending stress
Advantage against
bending stress
Mounting
face
Perforation or slit
Break P.C.board with
mounted side up.
Perforation or slit
Break P.C.board with
mounted side down.
Chip
arrangement
(Direction)
Mount perpendicularly to
perforation or slit
Perforation or slit
Mount in parallel with
perforation or slit
Perforation or slit
Distance from
slit
Closer to slit is higher stress
1
(
1
<
2
)
Away from slit is less stress
2
(
1
<
2
)
— 14 —
No. Process Condition
3 Designing
P.C.board
5) Mechanical stress varies according to location of chip capacitors on the P.C.board.
The stress in capacitors is in the following order.
A > B = C > D > E
4 Mounting 4-1. Stress from mounting head
If the mounting head is adjusted too low, it may induce excessive stress in the chip
capacitors to result in cracking. Please take following precautions.
1)
2)
3)
Adjust the bottom dead center of the mounting head to reach on the P.C.board surface
and not press it.
Adjust the mounting head pressure to be 1 to 3N of static weight.
To minimize the impact energy from mounting head, it is important to provide support
from the bottom side of the P.C.board.
See following examples.
Not recommended Recommended
Single sided
mounting
Double-sides
mounting
When the centering jaw is worn out, it may give mechanical impact on the capacitors to
cause crack. Please control the close up dimension of the centering jaw and provide
sufficient preventive maintenance and replacement of it.
A
C
B
E
Sli
t
Perforation
D
Crack
Support pin
Solder peeling
Crac
k
Support pin

CKCL22C0G1H101K085AL

Mfr. #:
Manufacturer:
TDK
Description:
Capacitor Arrays & Networks 100pF 50volts C0G 10%
Lifecycle:
New from this manufacturer.
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