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TLP2095(F)

P1-P3P4-P6P7-P9P10-P11
TLP2095
2014-09-01
4
Switching Characteristics
(Unless otherwise specified, Ta = -40 to 100°C,V
CC
= 3.0 to 20 V)
CHARACTERISTIC SYMBOL
TEST
CIRCUIT
CONDITION MIN TYP. MAX UNIT
Propagation Delay Time
to Logic High output
t
pLH
7, 8
(Note5)
I
F
= 0→5 mA 30 150 250 ns
Propagation Delay Time
to Logic Low output
t
pHL
I
F
= 5→0 mA 30 150 250 ns
Switching Time Dispersion
between ON and OFF
|t
pHL−
t
pLH
| ―
― ― 220 ns
Rise Time (10 – 90 %) t
r
I
F
=0→5 mA, V
CC
=5 V ― 30 75 ns
Fall Time (90 – 10 %) t
f
I
F
=5→0 mA, V
CC
=5 V ― 30 75 ns
Common Mode transient
Immunity at High Level Output
CM
H
9
V
CM
=1000V
p-p
, I
F
=5 mA,
V
CC
=20 V, Ta=25°C
-15 ― ― kV/μs
Common Mode transient
Immunity at Low Level Output
CM
L
V
CM
=1000V
p-p
, I
F
=0 mA,
V
CC
=20 V, Ta=25°C
15
― ― kV/μs
*All typical values are at Ta=25°C
Note5. V
CC
=4.5 to 20V at test circuit 7.
TEST CIRCUIT 1: V
OL
TEST CIRCUIT 2: V
OH
TEST CIRCUIT 3: I
CCL
TEST CIRCUIT 4: I
CCH
TEST CIRCUIT 5: I
OSL
TEST CI RCUI T 6: I
OSH
0.1μF
V
OL
V
CC
6
5
4
V
I
OL
↑
V
CC
GND
SHIELD
3
1
4
0.1μF
V
O
6
5
V
I
OH
↑
→
↑
I
F
V
CC
V
CC
GND
SHIELD
3
1
V
CC
1
6
5
4
I
CCL
A
0.1μF
V
CC
GND
SHIELD
3
V
CC
6
5
4
I
CCH
A
↑
→
I
F
0.1μF
1
V
CC
GND
SHIELD
3
1
6
0.1μF
V
O
V
CC
3
5
4
I
OSL
A
V
CC
GND
SHIELD
V
CC
0.1μF
I
F
1
3
6
5
4
→
I
OSH
↑
A
V
O
V
CC
GND
SHIELD
*V
OH
= V
CC
-V
O
TLP2095
2014-09-01
5
TEST CIRCUIT 7: Switching Time Test Circuit
TEST CIRCUIT 8: Switching Time Test Circuit
TEST CIRCUIT 9: Common Mode Transient Immunity Test Circuit
)(
)(800
s
t
f
V
H
CM
μ
=
)(
)(800
s
t
r
V
L
CM
μ
=
I
F
V
O
V
OH
V
OL
t
pHL
t
pLH
1.3V
50%
t
f
t
r
90%
10%
V
CC
GND
SHIELD
V
O
0.1μF
C
L
V
CC
5V
620 Ω
5 kΩ
P.G.: Pulse generator
C
L
is approximately 15 pF which includes
probe and stray capacitance.
(f=50 kHz , duty=50%,
tr=tf=5 ns)
1
3
6
5
4
I
F
=3 mA (P.G)
I
F
V
CC
I
F
V
O
V
OH
V
OL
t
pHL
t
pLH
1.3V
50%
t
f
t
r
90%
10%
V
CC
GND
I
F
V
O
0.1μF
C
L
C
L
is approximately 15 pF which includes
probe and stray capacitance.
P.G.: Pulse generator
I
F
=3 mA (P.G)
(f=50 kHz , duty=50%,
tr=tf=5 ns)
1
3
6
5
4
SHIELD
0.1μF
V
O
V
CC
SW
I
F
1
3
6
5
4
V
CM
A
B
→
CM
L
CM
H
V
CM
10%
90%
1000Ｖ
・SW A : I
F
=5mA
・SW B : I
F
=0mA
0.6V
3.7V
V
O
t
r
t
f
V
CC
GND
SHIELD
TLP2095
2014-09-01
6
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solder
·
Temperature profile example of using lead (Pb)-free solder
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
・Please preheat it at 150°C between 60 and 120 seconds.
・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated
at most once.
Time (s)
(°C)
240
210
160
60 to 120s
less than 30s
Package surface temperature
140
Time
(s)
(°C)
260
230
190
60 to 120s
30 to 50s
180
Package surface temperature
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum
temperature corresponding to the
solder paste type used by the
customer within the described profile.
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum
temperature corresponding to the
solder paste type used by the
customer within the described profile.
P1-P3P4-P6P7-P9P10-P11

TLP2095(F)

Mfr. #:
Buy TLP2095(F)
Manufacturer:
Toshiba
Description:
High Speed Optocouplers 5-Mbps AC-Input Gate Driver
Lifecycle:
New from this manufacturer.
Delivery:
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