3
Interconnect Solutions
http://www.3M.com/interconnects/
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3M™ Card Connector microSD™
Normal Polarization, Push-Push, Surfacemount 2900 Series
Physical
Electrical
Environmental
*"RoHS compliant" means that the product or part does not contain any of the following substances in excess of the following maximum concentration values
in any homogeneous material, unless the substance is in an application that is exempt under RoHS: (a) 0.1% (by weight) for lead, mercury, hexavalent
chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated by 3M in writing,
this information represents 3M's knowledge and belief based upon information provided by third party suppliers to 3M.
microSD is a trademark of SD Association in Japan.
Insulation Material:
High Temperature Thermoplastic
Flammability:
UL 94V-0
Color:
Black
Contact Material:
Copper Alloy
Plating
Underplating:
50 μ″ [ 1.27 μm ] min. Nickel
Wiping Area:
15 μ″ [ 0.38 μm ] min. Gold
Termination Area:
3 μ″ [ 0.076 μm ] max. Gold flash
Cover Material:
Stainless Steel
Underplating:
40 μ″ [ 1.02 μm ] min. Nickel
Solder Area:
Gold flash
Lock Pin and Link Pin Material:
Stainless Steel
Spring Material:
Copper Alloy
Plating:
30 μ″ [ 0.762 μm ] min. Nickel
Marking:
3M Logo
Current Rating:
0.5 A
Insulation Resistance:
100 ΜΩ min.
Withstanding Voltage:
500 VAC for one minute
Operating Temperature:
-25°C to +85°C
Storage Temperature:
-40°C to +85°C
Process Rating:
Maximum 250°C, with 40 seconds over 230°C
TS-2197-02
Sheet 1 of 3
• 1.85 mm low profile height
• Small size of 14.0 mm × 14.2 mm footprint
• Smooth push–push eject mechanism
• Card is retained when mated
• Card polarization
• Will accept a card thickness of 0.8 mm
• Mechanism prevents card from flying out upon
ejection
• Card detection indicator
• Metal–shielded cover
• microSD™ specification compliant
• RoHS* compliant
Date Modified: October 31, 2006
