With a 22nF gate capacitor, the inrush current, charge,
and discharge times are:
Case B: Fast Turn-On (With Current Limit)
In applications where the board capacitance (C
BOARD
)
is high, the inrush current causes a voltage drop across
R
SENSE
that exceeds the startup fast-comparator
threshold. The fast comparator regulates the voltage
across the sense resistor to V
FC,TH
. This effectively reg-
ulates the inrush current during startup. In this case,
the current charging C
BOARD
can be considered con-
stant and the turn-on time is:
The maximum inrush current in this case is:
Figure 6 shows the waveforms and timing diagrams for
a startup transient with current regulation (see the
Typical Operating Characteristics
section). When oper-
ating under this condition, an external gate capaci-
tor is not required.
ON Comparators
The ON comparators control the on/off function of the
MAX5930A/MAX5931A/MAX5931B. ON_ is also used to
reset the fault latch (latch mode). Pull V
ON_
low for
100µs, t
UNLATCH
, to reset the shutdown latch. ON_ also
programs the UVLO threshold (see Figure 10). A resis-
tive divider between V
IN_
, V
ON_
, and GND sets the
user-programmable turn-on voltage. In power-sequenc-
ing mode, an RC circuit can be used at ON_ to set the
delay timing (see Figure 11).
Using the MAX5930A/MAX5931A/
MAX5931B on the Backplane
Using the MAX5930A/MAX5931A/MAX5931B on the
backplane allows multiple cards with different input
capacitance to be inserted into the same slot even if
the card does not have on-board hot-swap protection.
The startup period can be triggered if IN_ is connected
to ON_ through a trace on the card (Figure 12).
Input Transients
The voltage at IN1, IN2, or IN3 must be above V
UVLO
dur-
ing inrush and fault conditions. When a short-circuit con-
dition occurs on the board, the fast-comparator trips
cause the external MOSFET gates to be discharged at
50mA according to the mode of operation (see the
Mode
section). The main system power supply must be able to
sustain a temporary fault current, without dropping below
the UVLO threshold of 2.45V, until the external MOSFET is
completely off. If the main system power supply collapses
below UVLO, the MAX5930A/MAX5931A/MAX5931B
force the device to restart once the supply has recov-
ered. The MOSFET is turned off in a very short time result-
ing in a high di/dt. The backplane delivering the power to
the external card must have low inductance to minimize
voltage transients caused by this high di/dt.
I
V
R
INRUSH
FCTH
SENSE
=
,
t
CVR
V
ON
BOARD IN SENSE
FCTH
=
××
,
I
F
pF nF
AmA
t
nF V nC
A
ms
t
nF V nC
mA
ms
t
nF V nC
mA
s
INRUSH
CHARGE
DISCHARGE NORMAL
DISCHARGE STRONG
=
μ
+
×+=
=
×+
μ
=
=
×+
=
=
×+
=
6
600 22
100 0 26 5
22 10 4 60
100
289
22 10 4 60
3
0 096
22 10 4 60
50
58
.
.
.
.
.
.
.
()
()
μ
μ
MAX5930A/MAX5931A/MAX5931B
Low-Voltage, Triple, Hot-Swap Controllers/
Power Sequencers/Voltage Trackers
______________________________________________________________________________________ 19
Figure 10. Adjustable Undervoltage Lockout
GATE_
SENSE_
V
TURN-ON
-
(R
2
x R
1
) V
ON
,
TH
R
2
ON_
V
IN
IN_
R
1
R
2
MAX5930A
MAX5931A
MAX5931B
Figure 9. Operating with an External Gate Capacitor
GATE_
SENSE_
GND
ON_
R
SENSE_
V
OUT_
C
GATE
C
BOARD
V
IN_
IN_
R
PULLUP
STAT_
MAX5930A
MAX5931A
MAX5931B
MAX5930A/MAX5931A/MAX5931B
MOSFET Thermal Considerations
During normal operation, the external MOSFETs dissi-
pate little power. The MOSFET R
DS(ON)
is low when the
MOSFET is fully enhanced. The power dissipated in nor-
mal operation is P
D
= I
LOAD
2
x R
DS(ON)
. The most
power dissipation occurs during the turn-on and turn-off
transients when the MOSFETs are in their linear regions.
By taking into consideration the worst-case scenario of a
continuous short-circuit fault, consider these two cases:
1) The single turn-on with the device latched after a
fault: MAX5930A/MAX5931A/MAX5931B (LATCH =
high or unconnected).
2) The continuous autoretry after a fault: MAX5930A/
MAX5931A/MAX5931B (LATCH = low).
MOSFET manufacturers typically include the package
thermal resistance from junction to ambient (R
θJA
) and
thermal resistance from junction to case (R
θJC
), which
determine the startup time and the retry duty cycle (d =
t
START
/(t
START
+ t
RETRY
). Calculate the required tran-
sient thermal resistance with the following equation:
where I
START
= V
SU,TH
/R
SENSE
.
Z
TT
VI
JA MAX
JMAX A
IN START
θ ()
×
Low-Voltage, Triple, Hot-Swap Controllers/
Power Sequencers/Voltage Trackers
20 ______________________________________________________________________________________
INY
GATEY
INZ
GATEZ
Q1
R
SENSEY
SENSEY
R
SENSEZ
SENSEZ
Q2
C
BOARDZ
OUTY
C
BOARDY
OUTZ
V
Y
C
1
R
1
V
EN
V
Z
ON
OFF
GND
ON
GND
V
ONY, TH
V
ONZ, TH
t
DELAY
V
EN
t
1
= -R
1
C
1
ln( )
V
EN
- V
ONY, TH
V
EN
V
ON
V
Y
V
Z
t
0
t
1
t
2
t
2
= -R
1
C
1
ln( )
V
EN
- V
ONZ, TH
V
EN
t
DELAY
= -R
1
C
1
ln( )
V
EN
- V
ONY, TH
V
EN
- V
ONZ, TH
MAX5930A
MAX5931A
MAX5931B
Figure 11. Power Sequencing: Channel Z Turns On t
DELAY
After Channel Y
Layout Considerations
To take full tracking advantage of the switch response
time to an output fault condition, it is important to keep all
traces as short as possible and to maximize the high-cur-
rent trace dimensions to reduce the effect of undesirable
parasitic inductance. Place the MAX5930A/
MAX5931A/MAX5931B close to the card’s connector.
Use a ground plane to minimize impedance and induc-
tance. Minimize the current-sense resistor trace length
(<10mm), and ensure accurate current sensing with
Kelvin connections (Figure 13).
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence, the
power dissipation across the switch increases, as does
the die temperature. An efficient way to achieve good
power dissipation on a surface-mount package is to lay
out two copper pads directly under the MOSFET pack-
age on both sides of the board. Connect the two pads
to the ground plane through vias, and use enlarged
copper mounting pads on the topside of the board.
MAX5930A/MAX5931A/MAX5931B
Low-Voltage, Triple, Hot-Swap Controllers/
Power Sequencers/Voltage Trackers
______________________________________________________________________________________ 21
Figure 13. Kelvin Connection for the Current-Sense Resistors
SENSE RESISTOR
HIGH-CURRENT PATH
MAX5930A
MAX5931A
MAX5931B
Figure 12. Using the MAX5930A/MAX5931A/MAX5931B on a
Backplane
ON_
IN_
GATE_
V
IN
V
OUT
SENSE_
MAX5930A
MAX5931A
MAX5931B
C
BOARD
BACKPLANE
POWER
SUPPLY
REMOVABLE CARD
WITH NO HOT-INSERTION
PROTECTION

MAX5931AEEP+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Hot Swap Voltage Controllers Triple Hot-Swap Controller
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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