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STTH1L06A

P1-P3P4-P6P7-P9
Characteristics STTH1L06
4/9 Doc ID 8321 Rev 4
Figure 5. Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4)
Figure 6. Peak reverse recovery current
versus dI
F
/dt (90% confidence)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tp(s)
SMA
T
δ
=tp/T
tp
Zth(j-a)/Rth(j-a)
δ
= 0.5
δ
= 0.2
δ
= 0.1
Single pulse
0.0
0.3
0.5
0.8
1.0
1.3
1.5
1.8
2.0
2.3
2.5
0 5 10 15 20 25 30 35 40 45 50
dIF/dt(A/µs)
VR=400V
Tj=125°C
IF=2 x IF(av)IF=2 x IF(av)
IF=0.5 x IF(av)IF=0.5 x IF(av)
IF=IF(av)IF=IF(av)
IF=0.25 x IF(av)IF=0.25 x IF(av)
IRM(A)
Figure 7. Reverse recovery time versus dI
F
/dt
(90% confidence)
Figure 8. Reverse recovery charges versus
dI
F
/dt (90% confidence)
0
100
200
300
400
500
600
700
800
0 5 10 15 20 25 30 35 40 45 50
dIF/dt(A/µs)
VR=400V
Tj=125°C
IF=IF(av)IF=IF(av)
IF=0.5 x IF(av)IF=0.5 x IF(av)
IF=2 x IF(av)IF=2 x IF(av)
trr(ns)
0
20
40
60
80
100
120
140
160
180
200
220
0 5 10 15 20 25 30 35 40 45 50
dIF/dt(A/µs)
VR=400V
Tj=125°C
IF=IF(av)
IF=0.5 x IF(av)
IF=2 x IF(av)
Qrr(nC)
Figure 9. Softness factor versus dI
F
/dt
(typical values)
Figure 10. Relative variations of dynamic
parameters versus junction
temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0 5 10 15 20 25 30 35 40 45 50
dIF/dt(A/µs)
IF=IF(av)
VR=400V
Tj=125°C
S factor
0.00
0.25
0.50
0.75
1.00
1.25
25 50 75 100 125
Tj(°C)
IRM
QRR
S factor
IF=IF(av)
VR=400V
Reference: Tj=125°C
STTH1L06 Characteristics
Doc ID 8321 Rev 4 5/9
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead
(Epoxy printed circuit board FR4, copper thickness: 35 µm)
Figure 11. Transient peak forward voltage
versus dI
F
/dt (90% confidence)
Figure 12. Forward recovery time versus dI
F
/dt
(90% confidence)
0
5
10
15
20
25
0 20 40 60 80 100 120 140 160 180 200
dIF/dt(A/µs)
IF=IF(av)
Tj=125°C
VFP(V)
0
20
40
60
80
100
120
140
160
180
200
0 20 40 60 80 100 120 140 160 180 200
dIF/dt(A/µs)
IF=IF(av)
VFR=1.1 x VF max.
Tj=125°C
tfr(ns)
Figure 13. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 14. Thermal resistance junction to
ambient versus copper surface
under each lead
1
10
100
1 10 100 1000
VR(V)
F=1MHz
Vosc=30mV
Tj=25°C
C(pF)
0
10
20
30
40
50
60
70
80
90
100
110
012345678910
S(cm²)
DO-41
Lleads=10mm
SMB
Rth(j-a)(°
C/
W)
Epoxy printed circuit board FR4, copper thickness: 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S(cm²)
SMA
Rth(j-a)(°C/W)
Package information STTH1L06
6/9 Doc ID 8321 Rev 4
2 Package information
● Epoxy meets UL 94, V0
● Band indicates cathode
● Bending method (DO-41): see Application note AN1471
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 16. Footprint (dimensions in mm)
Table 6. SMA dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
E
C
L
E1
D
A1
A2
b
2.63
5.43
1.4
1.64
1.4
P1-P3P4-P6P7-P9

STTH1L06A

Mfr. #:
Buy STTH1L06A
Manufacturer:
STMicroelectronics
Description:
Rectifiers 1.0 Amp 600 Volt
Lifecycle:
New from this manufacturer.
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