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VM800C43A-N
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
NXP Semiconductors
NX3020NAKS
30 V
, 180 mA dual N-channel T
rench MOSFET
NX3020NAKS
All information provided in this document is subject to legal disclaimers.
© NXP N.V. 2013. All rights reserved
Product data sheet
11 November 2013
9 / 15
Q
G
(nC)
0
0.8
0.6
0.2
0.4
017aaa671
4
6
2
8
10
V
GS
(V)
0
I
D
= 0.15 A; V
DS
= 15 V; T
amb
= 25 °C
Fig. 14.
Gate-source voltage as a function of gate
charge; typical values
017aaa137
V
GS
V
GS(th)
Q
GS1
Q
GS2
Q
GD
V
DS
Q
G(tot)
I
D
Q
GS
V
GS(pl)
Fig. 15.
Gate charge waveform definitions
017aaa672
V
SD
(V)
0
1.2
0.8
0.4
0.2
0.3
0.1
0.4
0.5
I
S
(A)
0
T
j
= 150 °C
T
j
= 25 °C
V
GS
= 0 V
Fig. 16.
Source current as a function of source-drain voltage; typical values
1
1.
T
est information
t
1
t
2
P
t
006aaa812
duty cycle δ
=
t
1
t
2
Fig. 17.
Duty cycle definition
NXP Semiconductors
NX3020NAKS
30 V
, 180 mA dual N-channel T
rench MOSFET
NX3020NAKS
All information provided in this document is subject to legal disclaimers.
© NXP N.V. 2013. All rights reserved
Product data sheet
11 November 2013
10 / 15
12.
Package outline
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
SOT363
SC-88
w
B
M
b
p
D
e
1
e
pin 1
index
A
A
1
L
p
Q
detail X
H
E
E
v
M
A
A
B
y
0
1
2 mm
scale
c
X
1
3
2
4
5
6
Plastic surface-mounted package; 6 leads
SOT363
UNIT
A
1
max
b
p
c
D
E
e
1
H
E
L
p
Q
y
w
v
mm
0.1
0.30
0.20
2.2
1.8
0.25
0.10
1.35
1.15
0.65
e
1.3
2.2
2.0
0.2
0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
0.25
0.15
A
1.1
0.8
04-11-08
06-03-16
Fig. 18.
Package outline TSSOP6 (SOT363)
NXP Semiconductors
NX3020NAKS
30 V
, 180 mA dual N-channel T
rench MOSFET
NX3020NAKS
All information provided in this document is subject to legal disclaimers.
© NXP N.V. 2013. All rights reserved
Product data sheet
11 November 2013
11 / 15
13.
Soldering
solder lands
solder resist
occupied area
solder paste
sot363_fr
2.65
2.35
0.4 (2×)
0.6
(2×)
0.5
(4×)
0.5
(4×)
0.6
(4×)
0.6
(4×)
1.5
1.8
Dimensions in mm
Fig. 19.
Reflow soldering footprint for TSSOP6 (SOT363)
sot363_fw
solder lands
solder resist
occupied area
preferred transport
direction during soldering
5.3
1.3
1.3
1.5
0.3
1.5
4.5
2.45
2.5
Dimensions in mm
Fig. 20.
W
ave soldering footprint for TSSOP6 (SOT363)
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
VM800C43A-N
Mfr. #:
Buy VM800C43A-N
Manufacturer:
Bridgetek
Description:
Video IC Development Tools Video Module No Display
Lifecycle:
New from this manufacturer.
Delivery:
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