LTC3419
10
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deviations do not offer much relief. Note that capacitor
manufacturers ripple current ratings are often based on
only 2000 hours lifetime. This makes it advisable to further
derate the capacitor, or choose a capacitor rated at a higher
temperature than required. Several capacitors may also be
paralleled to meet the size or height requirements of the
design. An additional 0.1μF to 1μF ceramic capacitor is
also recommended on V
IN
for high frequency decoupling
when not using an all-ceramic capacitor solution.
Output Capacitor (C
OUT
) Selection
The selection of C
OUT
is driven by the required effective
series resistance (ESR). Typically, once the ESR requirement
for C
OUT
has been met, the RMS current rating generally
far exceeds the I
RIPPLE(P-P)
requirement. The output ripple
ΔV
OUT
is determined by:
ΔΔVIESR
fC
OUT L
O OUT
≈+
1
8
where f
O
= operating frequency, C
OUT
= output capacitance
and ΔI
L
= ripple current in the inductor. For a fi xed output
voltage, the output ripple is highest at maximum input
voltage since ΔI
L
increases with input voltage.
If tantalum capacitors are used, it is critical that the capacitors
are surge tested for use in switching power supplies. An
excellent choice is the AVX TPS series of surface mount
tantalum. These are specially constructed and tested for low
ESR so they give the lowest ESR for a given volume. Other
capacitor types include Sanyo POSCAP, Kemet T510 and
T495 series, and Sprague 593D and 595D series. Consult
the manufacturer for other specifi c recommendations.
Using Ceramic Input and Output Capacitors
Higher values, lower cost ceramic capacitors are now
becoming available in smaller case sizes. Their high
ripple current, high voltage rating and low ESR make
them ideal for switching regulator applications. Because
the LTC3419 control loop does not depend on the output
capacitors ESR for stable operation, ceramic capacitors
can be used freely to achieve very low output ripple and
small circuit size.
However, care must be taken when ceramic capacitors are
used at the input. When a ceramic capacitor is used at the
input and the power is supplied by a wall adapter through
long wires, a load step at the output can induce ringing at
the input, V
IN
. At best, this ringing can couple to the output
and be mistaken as loop instability. At worst, a sudden
inrush of current through the long wires can potentially
cause a voltage spike at V
IN
, large enough to damage the
part. For more information, see Application Note 88.
When choosing the input and output ceramic capacitors,
choose the X5R or X7R dielectric formulations. These
dielectrics have the best temperature and voltage charac-
teristics of all the ceramics for a given value and size.
Setting the Output Voltage
The LTC3419 regulates the V
FB1
and V
FB2
pins to 0.6V
during regulation. Thus, the output voltage is set by a
resistive divider according to the following formula:
VV
R
R
OUT
=+
06 1
2
1
2.()
Keeping the current small (<10μA) in these resistors
maximizes effi ciency, but making it too small may allow
stray capacitance to cause noise problems or reduce the
phase margin of the error amp loop.
To improve the frequency response of the main control
loop, a feedback capacitor (C
F
) may also be used. Great
care should be taken to route the V
FB
line away from noise
sources, such as the inductor or the SW line.
Fixed output versions of the LTC3419 (e.g. LTC3419-1)
include an internal resistive divider, eliminating the need
for external resistors. The resistor divider is chosen
such that the V
FB
input current is approximately 3μA. For
these versions the V
FB
pin should be connected directly
to V
OUT
. Table 2 lists the fi xed output voltages available
for the LTC3419.
APPLICATIONS INFORMATION
Table 2. Fixed Output Voltage Versions
PART NUMBER V
OUT1
V
OUT2
LTC3419 Adjustable Adjustable
LTC3419-1 1.575V 1.8V
LTC3419
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Checking Transient Response
The regulator loop response can be checked by looking
at the load transient response. Switching regulators
take several cycles to respond to a step in load current.
When a load step occurs, V
OUT
immediately shifts by an
amount equal to ΔI
LOAD
• ESR, where ESR is the effective
series resistance of C
OUT
. ΔI
LOAD
also begins to charge or
discharge C
OUT
generating a feedback error signal used by
the regulator to return V
OUT
to its steady-state value. During
this recovery time, V
OUT
can be monitored for overshoot
or ringing that would indicate a stability problem.
The initial output voltage step may not be within the
bandwidth of the feedback loop, so the standard second
order overshoot/DC ratio cannot be used to determine the
phase margin. In addition, feedback capacitors (C
F1
and
C
F2
) can be added to improve the high frequency response,
as shown in Figure 1. Capacitor C
F
provides phase lead by
creating a high frequency zero with R2 which improves
the phase margin.
The output voltage settling behavior is related to the stability
of the closed-loop system and will demonstrate the actual
overall supply performance. For a detailed explanation of
optimizing the compensation components, including a re-
view of control loop theory, refer to Application Note 76.
In some applications, a more severe transient can be caused
by switching in loads with large (>1μF) input capacitors. The
discharged input capacitors are effectively put in parallel
with C
OUT
, causing a rapid drop in V
OUT
. No regulator can
deliver enough current to prevent this problem if the switch
connecting the load has low resistance and is driven quickly.
The solution is to limit the turn-on speed of the load switch
driver. A Hot Swap™ controller is designed specifi cally for
this purpose and usually incorporates current limiting,
short-circuit protection, and soft-starting.
Effi ciency Considerations
The percent effi ciency of a switching regulator is equal to
the output power divided by the input power times 100%.
It is often useful to analyze individual losses to determine
what is limiting the effi ciency and which change would
produce the most improvement. Percent effi ciency can
be expressed as:
% Effi ciency = 100% – (L1 + L2 + L3 + ...)
where L1, L2, etc., are the individual losses as a percentage
of input power.
Although all dissipative elements in the circuit produce
losses, four sources usually account for the losses in
LTC3419 circuits: 1) V
IN
quiescent current, 2) switching
losses, 3) I
2
R losses, 4) other system losses.
1. The V
IN
current is the DC supply current given in the
Electrical Characteristics which excludes MOSFET
driver and control currents. V
IN
current results in a
small (<0.1%) loss that increases with V
IN
, even at
no load.
2. The switching current is the sum of the MOSFET driver
and control currents. The MOSFET driver current results
from switching the gate capacitance of the power
MOSFETs. Each time a MOSFET gate is switched from
low to high to low again, a packet of charge dQ moves
from V
IN
to ground. The resulting dQ/dt is a current
out of V
IN
that is typically much larger than the DC bias
current. In continuous mode, I
GATECHG
= f
O
(Q
T
+ Q
B
),
where Q
T
and Q
B
are the gate charges of the internal top
and bottom MOSFET switches. The gate charge losses
are proportional to V
IN
and thus their effects will be
more pronounced at higher supply voltages.
3. I
2
R losses are calculated from the DC resistances
of the internal switches, R
SW
, and external inductor,
R
L
. In continuous mode, the average output current
ows through inductor L, but is “chopped” between
the internal top and bottom switches. Thus, the series
resistance looking into the SW pin is a function of both
top and bottom MOSFET R
DS(ON)
and the duty cycle
(DC) as follows:
R
SW
= (R
DS(ON)TOP
) • (DC) + (R
DS(ON)BOT
) • (1– DC)
APPLICATIONS INFORMATION
Hot Swap is a trademark of Linear Technology Corporation.
LTC3419
12
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The R
DS(ON)
for both the top and bottom MOSFETs can be
obtained from the Typical Performance Characteristics
curves. Thus, to obtain I
2
R losses:
I
2
R losses = I
OUT
2
• (R
SW
+ R
L
)
4. Other “hidden” losses, such as copper trace and
internal battery resistances, can account for additional
effi ciency degradations in portable systems. It is very
important to include these “system” level losses in
the design of a system. The internal battery and fuse
resistance losses can be minimized by making sure that
C
IN
has adequate charge storage and very low ESR at
the switching frequency. Other losses, including diode
conduction losses during dead-time, and inductor
core losses, generally account for less than 2% total
additional loss.
Thermal Considerations
In a majority of applications, the LTC3419 does not
dissipate much heat due to its high effi ciency. In the
unlikely event that the junction temperature somehow
reaches approximately 150°C, both power switches will be
turned off and the SW node will become high impedance.
The goal of the following thermal analysis is to determine
whether the power dissipated causes enough temperature
rise to exceed the maximum junction temperature (125°C)
of the part. The temperature rise is given by:
T
RISE
= P
D
θ
JA
Where P
D
is the power dissipated by the regulator and
θ
JA
is the thermal resistance from the junction of the die
to the ambient temperature. The junction temperature,
T
J
, is given by:
T
J
= T
RISE
+ T
AMBIENT
As a worst-case example, consider the case when the
LTC3419 is in dropout on both channels at an input voltage
of 2.7V with a load current of 600mA and an ambient
temperature of 70°C. From the Typical Performance
Characteristics graph of Switch Resistance, the R
DS(ON)
of the main switch is 0.6Ω. Therefore, power dissipated
by each channel is:
P
D
= I
OUT
2
• R
DS(ON)
= 216mV
Given that the thermal resistance of a properly soldered
DFN package is approximately 40°C/W, the junction
temperature of an LTC3419 device operating in a 70°C
ambient temperature is approximately:
T
J
= (2 • 0.216W • 40°C/W) + 70°C = 87.3°C
which is well below the absolute maximum junction
temperature of 125°C.
PC Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3419. These items are also illustrated graphically in the
layout diagrams of Figures 2 and 3. Check the following
in your layout:
1. Does the capacitor C
IN
connect to the power V
IN
(Pin 5)
and GND (Pin 9) as closely as possible? This capacitor
provides the AC current of the internal power MOSFETs
and their drivers.
2. Are the respective C
OUT
and L closely connected? The
(–) plate of C
OUT
returns current to GND and the (–)
plate of C
IN
.
3. The resistor divider, R1 and R2, must be connected
between the (+) plate of C
OUT1
and a ground sense line
terminated near GND (Pin 9). The feedback signals V
FB1
and V
FB2
should be routed away from noisy components
and traces, such as the SW lines (Pins 4 and 6), and
their trace length should be minimized.
4. Keep sensitive components away from the SW pins, if
possible. The input capacitor C
IN
and the resistors R1,
R2, R3 and R4 should be routed away from the SW
traces and the inductors.
5. A ground plane is preferred, but if not available, keep
the signal and power grounds segregated with small
signal components returning to the GND pin at a single
point. These ground traces should not share the high
current path of C
IN
or C
OUT
.
6. Flood all unused areas on all layers with copper.
Flooding with copper will reduce the temperature rise
of power components. These copper areas should be
connected to V
IN
or GND.
APPLICATIONS INFORMATION

LTC3419EMS-1#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Dual 600mA, 2.25MHz Synchronous Step Down
Lifecycle:
New from this manufacturer.
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