LTC3419
13
3419fa
APPLICATIONS INFORMATION
Figure 2. LTC3419 Layout Diagram (See Board Layout Checklist)
Figure 3. LTC3419 Suggested Layout
V
IN
RUN2 RUN1
LTC3419
V
FB2
SW2
SW1
V
FB1
C
F2
C
F1
GND
V
IN
2.5V TO 5.5V
V
OUT2
V
OUT1
3419 F02
R3 R1
R4
L2 L1
R2
C
OUT2
C1
C
OUT1
BOLD LINES INDICATE HIGH CURRENT PATHS
MODE
L1
3419 F03
L2
C
IN
C
OUT1
C
OUT2
V
OUT2
V
OUT1
GND
R2 R1 R3 R4
C
F1
C
F2
V
FB1
RUN1
MODE
SW1
V
FB2
RUN2
SW2
V
IN
VIA TO GND
VIA TO V
IN
Design Example
As a design example, consider using the LTC3419 in a
portable application with a Li-Ion battery. The battery
provides a V
IN
ranging from 2.8V to 4.2V. The load on
each channel requires a maximum of 600mA in active
mode and 2mA in standby mode. The output voltages are
V
OUT1
= 2.5V and V
OUT2
= 1.8V.
Start with channel 1. First, calculate the inductor value
for about 40% ripple current (240mA in this example) at
maximum V
IN
. Using a derivation of Equation 1:
L
V
MHz mA
V
V
1
25
2 25 240
1
25
42
18=−
=
.
.•()
.
.
.77μH
For the inductor, use the closest standard value of
2.2μH.
A 10μF ceramic capacitor should be more than suffi cient
for this output capacitor. As for the input capacitor, a
typical value of C
IN
= 10μF should suffi ce, as the source
impedance of a Li-Ion battery is very low.
The feedback resistors program the output voltage. To
maintain high effi ciency at light loads, the current in these
resistors should be kept small. Choosing 10μA with the
0.6V feedback voltage makes R1~60k. A close standard
1% resistor is 59k. Using Equation 2.
R
V
Rk
OUT
2
06
1 1 187=−
=
.
An optional 22pF feedback capacitor (C
F1
) may be used
to improve transient response.
LTC3419
14
3419fa
V
IN
= 3.6V
V
OUT
= 1.8V
I
LOAD
= 40mA TO 600mA
I
LOAD
500mA/DIV
I
L
500mA/DIV
V
OUT
100mV/DIV
AC-COUPLED
20μs/DIV
3419 F04c1
V
IN
= 3.6V
V
OUT
= 2.5V
I
LOAD
= 40mA TO 600mA
I
LOAD
500mA/DIV
I
L
500mA/DIV
V
OUT
100mV/DIV
AC-COUPLED
20μs/DIV
3419 F04c2
Using the same analysis for channel 2 (V
OUT2
= 1.8V),
the results are:
L2 = 1.9μH
R3 = 59k
R4 = 118k
C
F2
= 22pF
Figure 4 shows the complete schematic for this example,
along with the effi ciency curve and transient response.
Figure 4a. Design Example Circuit
Figure 4b. Effi ciency vs Output Current
Figure 4c. Transient Response
APPLICATIONS INFORMATION
V
IN
RUN2 RUN1
LTC3419
V
FB2
SW2
SW1
MODE
V
FB1
C
F2
, 22pF C
F1
, 22pF
GND
V
IN
2.5V TO 5.5V
V
OUT2
1.8V AT
600mA
V
OUT1
2.5V AT
600mA
3419 F04a
R4
118k
R2
187k
R3
59k
R1
59k
L2
2.2
μH
L1
2.2μH
C
OUT2
10μF
C
OUT1
10μF
C1
10
μF
C1, C2, C3: TAIYO YUDEN JMK316BJ106ML L1, L2: TDK VLF3010AT2R2M1RD
Load Step Transient Response
OUTPUT CURRENT (mA)
EFFICIENCY (%)
100
90
80
70
60
50
40
30
20
10
0
0.1 10 100 10001
V
OUT
= 1.8V
V
IN
= 2.7V
V
IN
= 3.6V
V
IN
= 4.2V
3419 F04b
OUTPUT CURRENT (mA)
EFFICIENCY (%)
100
90
80
70
60
50
40
30
20
10
0
0.1 10 100 10001
V
OUT
= 2.5V
V
IN
= 2.7V
V
IN
= 3.6V
V
IN
= 4.2V
LTC3419
15
3419fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation
that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
MSOP (MS) 0307 REV E
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
12
3
45
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8910
7
6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
DETAIL “A”
0.53 ± 0.152
(.021 ± .006)
0.254
(.010)
0° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
0.50
(.0197)
BSC
0.1016 ± 0.0508
(.004 ± .002)
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE
0.102mm (.004") MAX

LTC3419IMS-1#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Dual 600mA, 2.25MHz Synchronous Step-Down
Lifecycle:
New from this manufacturer.
Delivery:
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