IXCP01N90E

Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 150°C 900 V
V
DGR
T
J
= 25°C to 150°C; R
GS
= 1 M 900 V
V
GS
Continuous ±20 V
V
GSM
Transient ±30 V
P
D
T
C
= 25°C40W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6 mm (0.062 in.) from case for 10 s 300 °C
M
d
Mounting torque with 3.5mm screw (TO-220) 0.55/5 Nm/lb.in.
Weight TO-251/252 = 1 g, TO-220 = 4 g
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
V
DSS
V
GS
= 0 V, I
D
= 25 µA 900 V
V
GS(th)
V
DS
= V
GS
, I
D
= 25 µA 2.5 5 V
I
GSS
V
GS
= ±20 V, V
DS
= 0 ±50 nA
I
DSS
V
DS
= V
DSS;
V
GS
= 0 V 10 µA
R
DS(on)
V
GS
= 10 V, I
D
= 50 mA 80
Pulse test, t 300 µs, duty cycle d 2 %
I
DP
Plateau Current; V
DS
= 10 V, V
GS
= 10V 100 130 mA
Pulse test, t 300 µs, duty cycle d 2 %
Gate Controlled
Current Limiter
N-Channel, Enhancement Mode
D
S
Features
High output resistance in the saturated
mode of operation
Rugged HDMOS
TM
process
Stable peak drain current limit
High voltage current regulator
International standard packages
Applications
Current regulation
Over current and over voltage
protection for sensitive loads
Linear regulator
G = Gate, D = Drain,
S = Source, TAB = Drain
98701-A (8/02)
IXCP 01N90E
IXCY 01N90E
V
DSS
= 900 V
I
D(limit)
= 250mA
R
DS(on)
= 80
G
TO-220 (IXCP)
G
D
S
TAB
TO-252 (IXCY)
G
S
TAB
© 2002 IXYS All rights reserved
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
g
fs
V
DS
= 20 V; I
D
= 100 mA, pulse test 40 mS
C
iss
133 pF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 24 pF
C
rss
6.6 pF
t
d(on)
15 ns
t
r
V
DS
= 500 V, I
D
= 50 mA 137 ns
t
d(off)
V
GS
= 10 V, R
G
= 50 (External) 11 n s
t
f
131 ns
Q
g(on)
7.5 nC
Q
gs
V
GS
= 10 V, V
DS
= 500 V, I
D
= 50 mA 2.2 nC
Q
gd
3.0 nC
I
A(P)
/
T Plateau Current Shift V
DS
= 10 V, V
GS
= 10 V
±
50 ppm/K
with Temperature
V
AK
/
I
A(p)
Dynamic Resistance V
DS
= 20 V, V
GS
= 10 V 125 k
V
F
I
F
= 50mA 1.8 V
R
thJC
3.1 K/W
R
thCA
TO-220 80 K/W
TO-251/252 100 K/W
IXCP 01N90E
IXCY 01N90E
TO-252 AA Outline
Dim. Millimeter Inches
Min. Max.Min. Max.
A 2.19 2.38 0.086 0.094
A1 0.89 1.14 0.035 0.045
A2 0 0.13 0 0.005
b 0.64 0.89 0.025 0.035
b1 0.76 1.14 0.030 0.045
b2 5.21 5.46 0.205 0.215
c 0.46 0.58 0.018 0.023
c1 0.46 0.58 0.018 0.023
D 5.97 6.22 0.235 0.245
D1 4.32 5.21 0.170 0.205
E 6.35 6.73 0.250 0.265
E1 4.32 5.21 0.170 0.205
e 2.28 BSC 0.090 BSC
e1 4.57 BSC 0.180 BSC
H 9.40 10.42 0.370 0.410
L 0.51 1.02 0.020 0.040
L1 0.64 1.02 0.025 0.040
L2 0.89 1.27 0.035 0.050
L3 2.54 2.92 0.100 0.115
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
Pins: 1 - Gate 2 - Drain
3 - Source 4 - Drain
Bottom Side
TO-220 AB Dimensions
Temperature -
o
C
-50 -25 0 25 50 75 100 125
I
D
- milliamperes
80
100
120
140
160
180
V
GS
= 12V
11V
10V
9V
Figure 1, Output Characteristics at 25ºC
Figure 4. Drain Current vs, Temperature for a
constant gate-source voltage.
Figure 2. Drain Current vs.Gate Voltage
Figure 3. Dynamic Output Resistance R
O
vs. Drain
Current.
0 20 40 60 80 100 120 140 160
0K
100K
200K
300K
400K
500K
Dynamic Resistance R
O
- Ohms
I
D
- Milliamperes
T
J
= 25
o
C
Figure 5. Allowable Power Dissipation for
various heat sinking conditions. Note that
the junction temperature can be derated
by increasing the ambient temperature a
like amount.
V
GS
-Volts
6 8 10 12 14
I
D
- Milliamperes
1
10
100
Ambient Temperature -
o
C
25 50 75 100 125 150
Maximum Power Dissipation - Watts
0
2
4
6
8
10
12
15
20
30
40
50
60
80
100
R(th)
JA
: 10 K/W
V
DS
- Volts
0 1020304050
I
D
-
Milli
amperes
0
50
100
150
200
250
14V
13V
12V
11V
10V
9V
8V
6V
5V
V
GS
= 15V
7V
IXCP 01N90E
IXCY 01N90E
V
DS
= 20V
V
DS
= 20V

IXCP01N90E

Mfr. #:
Manufacturer:
Description:
MOSFET 0.01 Amps 900V
Lifecycle:
New from this manufacturer.
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