12
3378O–SEEPR–11/09
AT93C56A/66A
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green package + RoHS compliant.
3. “H” designates Green package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial Marketing.
6. AT93C56A Ordering Information
(1)
Ordering Code Package Operation Range
AT93C56A-10PU-2.7
(2)
AT93C56A-10PU-1.8
(2)
AT93C56A-10SU-2.7
(2)
AT93C56A-10SU-1.8
(2)
AT93C56AW-10SU-2.7
(2)
AT93C56AW-10SU-1.8
(2)
AT93C56A-10TU-2.7
(2)
AT93C56A-10TU-1.8
(2)
AT93C56AU3-10UU-1.8
(2)
AT93C56AD3-10DH-1.8
(3)
AT93C56AY1-10YU-1.8
(2)
(Not recommended for new design)
AT93C56AY6-10YH-1.8
(3)
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U3-1
8D3
8Y1
8Y6
Lead-free/Halogen-free/
Industrial Temperature
(40Cto85C)
AT93C56A-W1.8-11
(4)
Die Sales
Industrial Temperature
(40Cto85C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8S2 8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8U3-1 8-ball, die Ball Grid Array Package (dBGA2)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6 8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead package (DFN), (MLP 2x3 mm)
8D3
8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)
Options
2.7 Low-voltage (2.7V to 5.5V)
1.8 Low-voltage (1.8V to 5.5V)
