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AT93C66A-10PU-2.7

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23
13
3378O–SEEPR–11/09
AT93C56A/66A
Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green package + RoHS compliant.
3. “H” designates Green package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.
7. AT93C66A Ordering Information
(1)
Ordering Code Package Operation Range
AT93C66A-10PU-2.7
(2)
AT93C66A-10PU-1.8
(2)
AT93C66A-10SU-2.7
(2)
AT93C66A-10SU-1.8
(2)
AT93C66AW-10SU-2.7
(2)
AT93C66AW-10SU-1.8
(2)
AT93C66A-10TU-2.7
(2)
AT93C66A-10TU-1.8
(2)
AT93C66AU3-10UU-1.8
(2)
AT93C66AD3-10DH-1.8
(3)
AT93C66AY1-10YU-1.8
(2)
(Not recommended for new design)
AT93C66AY6-10YH-1.8
(3)
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U3-1
8D3
8Y1
8Y6
Lead-free/Halogen-free/
Industrial Temperature
(40Cto85C)
AT93C66A-W1.8-11
(4)
Die Sale
Industrial Temperature
(40Cto85C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8S2 8-lead, 0.200" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8U3-1 8-ball, die Ball Grid Array Package (dBGA2)
8Y1 8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8Y6 8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead package (DFN), (MLP 2x3 mm)
8D3
8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)
Options
2.7 Low-voltage (2.7V to 5.5V)
1.8 Low-voltage (1.8V to 5.5V)
14
3378O–SEEPR–11/09
AT93C56A/66A
8. Packaging Information
8.1 8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005 3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
15
3378O–SEEPR–11/09
AT93C56A/66A
8.2 8S1 – JEDEC SOIC
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
DRAWING NO.
R
REV.
Note:
10/7/03
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
8S1 B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 – 0.25
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.00
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
∅ 0˚ – 8˚
∅
Top View
End View
Side View
e
B
D
A
A1
N
E
1
C
E1
L
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23

AT93C66A-10PU-2.7

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Buy AT93C66A-10PU-2.7
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Description:
IC EEPROM 4K SPI 2MHZ 8DIP
Lifecycle:
New from this manufacturer.
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