16
3378O–SEEPR–11/09
AT93C56A/66A
8.3 8S2 – EIAJ SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8S2, 8-lead, 0.209" Body, Plastic Small
Outline Package (EIAJ)
10/7/03
8S2
C
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs are not included.
3. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.
4. Determines the true geometric position.
5. Values b and C apply to pb/Sn solder plated terminal. The standard thickness of the solder layer shall be 0.010 +0.010/0.005 mm.
A 1.70 2.16
A1 0.05 0.25
b 0.35 0.48 5
C 0.15 0.35 5
D 5.13 5.35
E1 5.18 5.40 2, 3
E 7.70 8.26
L 0.51 0.85
e 1.27 BSC 4
End View
Side View
e
b
A
A1
D
E
N
1
C
E1
L
Top View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs aren't included.
3. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.
4. Determines the true geometric position.
5. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm.
θ
θ
1
1
N
E
C
C
E1
E
A
b
L
A1
e
D
TOP VIEW
END VIEW
SIDE VIEW
A
A1
b
C
D
E1
E
L
θ
e
1.70
0.05
0.35
0.15
5.13
5.18
7.70
0.51
2.16
0.25
0.48
0.35
5.35
5.40
8.26
0.85
5
5
2, 3
4
1.27 BSC
DRAWING NO.
2325 Orchard Parkway
San Jose, CA 95131
R
REV.
8S2 D
04/07/06
TITLE
8S2, 8-lead, 0.209" Body, Plastic Small
Outline Package (EIAJ)
17
3378O–SEEPR–11/09
AT93C56A/66A
8.4 8Y6 – MiniMap (MLP 2x3)
TITLE
DRAWING NO. GPC
REV.
Package Drawing Contact:
packagedrawings@atmel.com
8Y6YNZ E
8Y6, 8-lead 2.0x3.0 mm Body, 0.50 mm Pitch,
UltraThin Mini-MAP, Dual No Lead Package
(Sawn)(UDFN)
11/21/08
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied to ground
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 2.00 BSC
E 3.00 BSC
D2 1.40 1.50 1.60
E2 - - 1.40
A - - 0.60
A1 0.0 0.02 0.05
A2 - - 0.55
A3 0.20 REF
L 0.20 0.30 0.40
e 0.50 BSC
b 0.20 0.25 0.30 2
A2
A2
b
(8X)
(8X)
Pin 1 ID
Pin 1 ID
Pin 1
Pin 1
Index
Index
Area
Area
A1
A1
A3
A3
D
E
A
L (8X)
L (8X)
e (6X)
e (6X)
1.50 REF.
1.50 REF.
D2
D2
E2
E2
18
3378O–SEEPR–11/09
AT93C56A/66A
8.5 8Y1 – Map
A 0.90
A1 0.00 0.05
D 4.70 4.90 5.10
E 2.80 3.00 3.20
D1 0.85 1.00 1.15
E1 0.85 1.00 1.15
b 0.25 0.30 0.35
e 0.65 TYP
L 0.50 0.60 0.70
P
IN
1
IN
D
E
X
A
R
E
A
D
E
A
A1
b
8
7
6
e
5
L
D1
E1
PIN 1 INDEX AREA
1
2
34
A
Top V i ew
End View
Bottom View
Side View
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8Y1, 8-lead (4.90 x 3.00 mm Body) MSOP Array Package
(MAP) Y1
C
8Y1
2/28/03
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE

AT93C66AW-10SU-2.7

Mfr. #:
Manufacturer:
Description:
IC EEPROM 4K SPI 2MHZ 8SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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