NCP346
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15
PACKAGE DIMENSIONS
THIN SOT−23−5
SN SUFFIX
CASE 483−02
ISSUE E
NOTES:
1 DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4 A AND B DIMENSIONS DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.1142 0.1220
B 1.30 1.70 0.0512 0.0669
C 0.90 1.10 0.0354 0.0433
D 0.25 0.50 0.0098 0.0197
G 0.85 1.05 0.0335 0.0413
H 0.013 0.100 0.0005 0.0040
J 0.10 0.26 0.0040 0.0102
K 0.20 0.60 0.0079 0.0236
L 1.25 1.55 0.0493 0.0610
M 0 10 0 10
S 2.50 3.00 0.0985 0.1181
0.05 (0.002)
123
54
S
A
G
L
B
D
H
C
K
M
J
__ _ _
0.7
0.028
1.0
0.039
ǒ
mm
inches
Ǔ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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NCP346/D
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