5-146268-2

1N5820, 1N5821, 1N5822
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4
NOTE 3 — DETERMINING MAXIMUM RATINGS
Reverse power dissipation and the possibility of thermal
runaway must be considered when operating this rectifier at
reverse voltages above 0.1 V
RWM
. Proper derating may be
accomplished by use of equation (1).
T
A(max)
= T
J(max)
R
q
JA
P
F(AV)
R
q
JA
P
R(AV)
(1)
where T
A(max)
= Maximum allowable ambient temperature
T
J(max)
= Maximum allowable junction temperature
(125°C or the temperature at which thermal
runaway occurs, whichever is lowest)
P
F(AV)
= Average forward power dissipation
P
R(AV)
= Average reverse power dissipation
R
q
JA
= Junction-to-ambient thermal resistance
Figures 1, 2, and 3 permit easier use of equation (1) by
taking reverse power dissipation and thermal runaway into
consideration. The figures solve for a reference temperature
as determined by equation (2).
T
R
= T
J(max)
R
q
JA
P
R(AV)
(2)
Substituting equation (2) into equation (1) yields:
T
A(max)
= T
R
R
q
JA
P
F(AV)
(3)
Inspection of equations (2) and (3) reveals that T
R
is the
ambient temperature at which thermal runaway occurs or
where T
J
= 125°C, when forward power is zero. The
transition from one boundary condition to the other is
evident on the curves of Figures 1, 2, and 3 as a difference
in the rate of change of the slope in the vicinity of 115°C. The
data of Figures 1, 2, and 3 is based upon dc conditions. For
use in common rectifier circuits, Table 1 indicates suggested
factors for an equivalent dc voltage to use for conservative
design, that is:
V
R(equiv)
= V
(FM)
F (4)
The factor F is derived by considering the properties of the
various rectifier circuits and the reverse characteristics of
Schottky diodes.
EXAMPLE: Find T
A(max)
for 1N5821 operated in a
12-volt dc supply using a bridge circuit with capacitive filter
such that I
DC
= 2.0 A (I
F(AV)
= 1.0 A), I
(FM)
/I
(AV)
= 10, Input
Voltage = 10 V
(rms)
, R
q
JA
= 40°C/W.
Step 1. Find V
R(equiv).
Read F = 0.65 from Table 1,
V
R(equiv)
= (1.41) (10) (0.65) = 9.2 V.
Step 2. Find T
R
from Figure 2. Read T
R
= 108°C
@ V
R
= 9.2 V and R
q
JA
= 40°C/W.
Step 3. Find P
F(AV)
from Figure 6. **Read P
F(AV)
= 0.85 W
@
I
(FM)
I
(AV)
10 and I
F(AV)
1.0A.
Step 4. Find T
A(max)
from equation (3).
T
A(max)
= 108 (0.85) (40) = 74°C.
**Values given are for the 1N5821. Power is slightly lower
for the 1N5820 because of its lower forward voltage, and
higher for the 1N5822. Variations will be similar for the
MBR-prefix devices, using P
F(AV)
from Figure 6.
Table 1. Values for Factor F
Circuit Half Wave Full Wave, Bridge
Full Wave,
Center Tapped*†
Load Resistive Capacitive* Resistive Capacitive Resistive Capacitive
Sine Wave 0.5 1.3 0.5 0.65 1.0 1.3
Square Wave 0.75 1.5 0.75 0.75 1.5 1.5
*Note that V
R(PK)
2.0 V
in(PK)
.
†Use line to center tap voltage for V
in.
1N5820, 1N5821, 1N5822
http://onsemi.com
5
Figure 1. Maximum Reference Temperature
1N5820
Figure 2. Maximum Reference Temperature
1N5821
Figure 3. Maximum Reference Temperature
1N5822
Figure 4. Steady-State Thermal Resistance
152.0
V
R
, REVERSE VOLTAGE (VOLTS)
115
125
105
304.0
V
R
, REVERSE VOLTAGE (VOLTS)
125
115
105
95
85
75
L, LEAD LENGTH (INCHES)
1/80
25
20
15
10
5.0
0
2/840
T
R
, REFERENCE TEMPERATURE ( C)T
R
JL
, THERMAL RESISTANCE
95
85
75
5.03.0 4.0 7.0 10 20
°
5.0 7.0 10 15 20 3/8 4/8 5/8 6/8 7/8 1.0
40
35
30
q
JUNCTION-TO-LEAD ( C/W)°
BOTH LEADS TO HEATSINK,
EQUAL LENGTH
MAXIMUM
TYPICAL
, REFERENCE TEMPERATURE ( C)
R
°
R
q
JA
(°C/W) = 70
50
40
28
20
15
10
8.0
15
V
R
, REVERSE VOLTAGE (VOLTS)
115
105
T
R
, REFERENCE TEMPERATURE ( C)
95
85
75
5.03.0 4.0 7.0 10 20
°
R
q
JA
(°C/W) = 70
50
40
28
20
15
10
8.0
125
30
R
q
JA
(°C/W) = 70
50
40
28
20
15
10
8.0
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k
0.05
0.03
0.02
0.01
0.1
t, TIME (ms)
0.5
0.3
0.2
1.0
LEAD LENGTH = 1/4
P
pk
P
pk
t
p
t
1
TIME
DUTY CYCLE = t
p
/t
1
PEAK POWER, P
pk
, is peak of an
equivalent square power pulse.
DT
JL
= P
pk
R
q
JL
[D + (1 - D) r(t
1
+ t
p
) + r(t
p
) - r(t
1
)] where:
DT
JL
= the increase in junction temperature above the lead temperature.
r(t) = normalized value of transient thermal resistance at time, t, i.e.:
r(t
1
+ t
p
) = normalized value of transient thermal resistance at time
t
1
+ t
p
, etc.
Figure 5. Thermal Response
20 k
The temperature of the lead should be measured using a ther‐
mocouple placed on the lead as close as possible to the tie point.
The thermal mass connected to the tie point is normally large
enough so that it will not significantly respond to heat surges
generated in the diode as a result of pulsed operation once
steady-state conditions are achieved. Using the measured
value of T
L
, the junction temperature may be determined by:
T
J
= T
L
+ DT
JL
1N5820, 1N5821, 1N5822
http://onsemi.com
6
3.00.1
I
F(AV)
, AVERAGE FORWARD CURRENT (AMP)
10
7.0
5.0
0.7
0.5
0.1
5.0
P
0.2 0.3 0.5 2.0
, AVERAGE POWER DISSIPATION (WATTS)
F(AV)
3.0
2.0
1.0
0.3
0.2
0.7 1.0 7.0 10
Figure 6. Forward Power Dissipation 1N5820-22
dc
SQUARE WAVE
T
J
125°C
SINE WAVE
I
(FM)
I
(AV)
p(ResistiveLoad)
Capacitive
Loads
5.0
10
20
T
A(A)
T
A(K)
T
L(A)
T
C(A)
T
J
T
C(K)
T
L(K)
P
D
R
q
S(A)
R
q
L(A)
R
q
J(A)
R
q
J(K)
R
q
L(K)
R
q
S(K)
NOTE 4 - APPROXIMATE THERMAL CIRCUIT MODEL
Use of the above model permits junction to lead thermal
resistance for any mounting configuration to be found. For
a given total lead length, lowest values occur when one side
of the rectifier is brought as close as possible to the heat sink.
Terms in the model signify:
T
A
= Ambient Temperature T
C
= Case Temperature
T
L
= Lead Temperature T
J
= Junction Temperature
R
q
S
= Thermal Resistance, Heatsink to Ambient
R
q
L
= Thermal Resistance, Lead-to-Heatsink
R
q
J
= Thermal Resistance, Junction-to-Case
P
D
= Total Power Dissipation = P
F
+ P
R
P
F
= Forward Power Dissipation
P
R
= Reverse Power Dissipation
(Subscripts (A) and (K) refer to anode and cathode sides,
respectively.) Values for thermal resistance components
are:
R
q
L
= 42°C/W/in typically and 48°C/W/in maximum
R
q
J
= 10°C/W typically and 16°C/W maximum
The maximum lead temperature may be found as follows:
T
L
= T
J(max)
n T
JL
where n T
JL
R
q
JL
· P
D
TYPICAL VALUES FOR R
q
JA
IN STILL AIR
Data shown for thermal resistance junction-to-ambient (R
q
JA
)
for the mountings shown is to be used as typical guideline values
for preliminary engineering, or in case the tie point temperature
cannot be measured.
1
2
3
Mounting
Method
Lead Length, L (in)
1/8 1/4 1/2 3/4
R
q
JA
50 51 53 55 °C/W
°C/W
°C/W
58 59 61 63
28
NOTE 5 — MOUNTING DATA
Mounting Method 1
P.C. Board where available
copper surface is small.
Mounting Method 3
P.C. Board with
2-1/2, x 2-1/2,
copper surface.
BOARD GROUND
PLANE
VECTOR PUSH-IN
TERMINALS T-28
Mounting Method 2
LL
LL
L = 1/2

5-146268-2

Mfr. #:
Manufacturer:
TE Connectivity
Description:
Headers & Wire Housings 04 MODII HDR DRST B/A 100 W/HD
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New from this manufacturer.
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