IRFR13N20D/IRFU13N20D
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
g
fs
Forward Transconductance 6.2 ––– ––– S V
DS
= 50V, I
D
= 7.8A
Q
g
Total Gate Charge ––– 25 38 I
D
= 7.8A
Q
gs
Gate-to-Source Charge ––– 7.3 11 nC V
DS
= 160V
Q
gd
Gate-to-Drain ("Miller") Charge ––– 12 18 V
GS
= 10V,
t
d(on)
Turn-On Delay Time ––– 11 ––– V
DD
= 100V
t
r
Rise Time ––– 27 ––– I
D
= 7.8A
t
d(off)
Turn-Off Delay Time ––– 17 ––– R
G
= 6.8Ω
t
f
Fall Time ––– 10 ––– V
GS
= 10V
C
iss
Input Capacitance ––– 830 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 140 ––– V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 35 ––– pF ƒ = 1.0MHz
C
oss
Output Capacitance ––– 990 ––– V
GS
= 0V, V
DS
= 1.0V, ƒ = 1.0MHz
C
oss
Output Capacitance ––– 57 ––– V
GS
= 0V, V
DS
= 160V, ƒ = 1.0MHz
C
oss
eff. Effective Output Capacitance ––– 59 ––– V
GS
= 0V, V
DS
= 0V to 160V
Dynamic @ T
J
= 25°C (unless otherwise specified)
ns
Parameter Typ. Max. Units
E
AS
Single Pulse Avalanche Energy ––– 130 mJ
I
AR
Avalanche Current ––– 7.8 A
E
AR
Repetitive Avalanche Energy ––– 11 mJ
Avalanche Characteristics
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 7.8A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 140 210 ns T
J
= 25°C, I
F
= 7.8A
Q
rr
Reverse RecoveryCharge ––– 750 1120 nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Diode Characteristics
13
52
A
Static @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 200 ––– ––– V V
GS
= 0V, I
D
= 250µA
∆V
(BR)DSS
/∆T
J
Breakdown Voltage Temp. Coefficient
––– 0.25 ––– V/°C Reference to 25°C, I
D
= 1mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– ––– 0.235 Ω V
GS
= 10V, I
D
= 8.0A
V
GS(th)
Gate Threshold Voltage 3.0 ––– 5.5 V V
DS
= V
GS
, I
D
= 250µA
––– ––– 25
µA
V
DS
= 200V, V
GS
= 0V
––– ––– 250 V
DS
= 160V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100 V
GS
= 30V
Gate-to-Source Reverse Leakage ––– ––– -100
nA
V
GS
= -30V
I
GSS
I
DSS
Drain-to-Source Leakage Current
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 1.4
R
θJA
Junction-to-Ambient (PCB mount)* ––– 50 °C/W
R
θJA
Junction-to-Ambient ––– 110
Thermal Resistance
