ams Datasheet Page 5
[v2-06] 2014-Oct-14 Document Feedback
AS5055A − Absolute Maximum Ratings
Stresses beyond those listed in “Absolute Maximum Ratings” on
page 5 may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at
these or any other conditions beyond those indicated in
“Electrical Characteristics” on page 6 is not implied. Exposure
to absolute maximum rating conditions for periods may affect
device reliability.
Figure 5:
Absolute Maximum Ratings
Symbol Parameter Min Max Units Comments
Electrical Parameters
VDD DC supply voltage -0.3 5.0 V
VDDp Peripheral supply voltage -0.3 VDD+0.3 V
V
IN Input pin voltage -0.3 5.0 V
I
scr
Input current (latchup
immunity)
-100 100 mA Norm: JEDEC 78
Electrostatic Discharge
ESD Electrostatic discharge ±1 - kV
Norm: MIL-STD-883 E method
3015
Continuous Power Dissipation
Θ
JA
Package thermal resistance - 33.5 °C/W
Velocity=0, Multi Layer PCB;
JEDEC Standard Testboard
P
t
Total power dissipation 36 mW
Temperature Ranges and Storage Conditions
T
strg
Storage temperature -55 125 °C
T
BODY Package body temperature 260 °C
The reflow peak soldering
temperature (body temperature)
specified is in accordance with
IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity
Classification for Non-Hermetic
Solid State Surface Mount
Devices”.
The lead finish for Pb-free leaded
packages is matte tin (100% Sn).
Humidity non-condensing 5 85 %
MSL Moisture Sensitive Level 3
Represents a maximum floor life
time of 168h
