2003 Oct 20 3
NXP Semiconductors Product data sheet
Quadruple low capacitance ESD
suppressor
BZA900AVL series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. DC working current limited by P
tot(max)
.
2. Device mounted on standard printed-circuit board.
ESD STANDARDS COMPLIANCE
THERMAL CHARACTERISTICS
Note
1. Solder point of common anode (pin 2).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per diode
I
Z
working current T
amb
= 25 °C − note 1 mA
I
F
continuous forward current T
amb
= 25 °C − 200 mA
I
FSM
non-repetitive peak forward current t
p
= 1 ms; square pulse − 3.5 A
P
tot
total power dissipation T
amb
= 25 °C; note 2; see Fig.5 − 335 mW
P
ZSM
non repetitive peak reverse power
dissipation
square pulse; t
p
= 1 ms − 6 W
T
stg
storage temperature −65 +150 °C
T
j
junction temperature − 150 °C
ESD electrostatic discharge IEC 61000-4-2 (contact discharge) 15 − kV
HBM MIL-Std 883 10 − kV
STANDARD CONDITIONS
IEC 61000-4-2, level 4 (ESD) >15 kV (air); >8 kV (contact discharge)
HBM MIL-Std 883, class 3 >4 kV
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-a
thermal resistance from junction to
ambient
all diodes loaded 370 K/W
R
th j-s
thermal resistance from junction to
solder point; note
1
one diode loaded 135 K/W
all diodes loaded 125 K/W
