IXFX100N25

© 2001 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 150°C 250 V
V
DGR
T
J
= 25°C to 150°C; R
GS
= 1 M 250 V
V
GS
Continuous ±20 V
V
GSM
Transient ±30 V
I
D25
T
C
= 25°C (MOSFET chip capability) 100 A
I
D104
T
C
= 104°C (External lead capability) 75 A
I
DM
T
C
= 25°C, pulse width limited by T
JM
400 A
I
AR
T
C
= 25°C 100 A
E
AR
T
C
= 25°C64mJ
E
AS
T
C
= 25°C3J
dv/dt I
S
I
DM
, di/dt 100 A/µs, V
DD
V
DSS
5 V/ns
T
J
150°C, R
G
= 2
P
D
T
C
= 25°C 560 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6 mm (0.063 in.) from case for 10 s 300 °C
M
d
Mounting torque TO-264 0.9/6 Nm/lb.in.
Weight PLUS 247 6 g
TO-264 10 g
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
V
DSS
V
GS
= 0 V, I
D
= 3mA 250 V
V
GS(th)
V
DS
= V
GS
, I
D
= 8mA 2.0 4.0 V
I
GSS
V
GS
= ±20 V, V
DS
= 0 ±200 nA
I
DSS
V
DS
= V
DSS
T
J
= 25°C 100 µA
V
GS
= 0 V T
J
= 125°C 2 mA
R
DS(on)
V
GS
= 10 V, I
D
= 0.5 I
D25
27 m
Note 1
Single MOSFET Die
Features
l
International standard packages
l
Low R
DS (on)
HDMOS
TM
process
l
Rugged polysilicon gate cell structure
l
Unclamped Inductive Switching (UIS)
rated
l
Low package inductance
- easy to drive and to protect
l
Fast intrinsic rectifier
Applications
l
DC-DC converters
l
Battery chargers
l
Switched-mode and resonant-mode
power supplies
l
DC choppers
l
AC motor control
l
Temperature and lighting controls
Advantages
l
PLUS 247
TM
package for clip or spring
mounting
l
Space savings
l
High power density
HiPerFET
TM
Power MOSFETs
98613B (5/01)
PLUS 247
TM
(IXFX)
G
D
(TAB)
G = Gate D = Drain
S = Source TAB = Drain
IXFX 100N25 V
DSS
= 250 V
IXFK 100N25 I
D25
= 100 A
R
DS(on)
= 27 m
t
rr
250 ns
S
G
D
(TAB)
TO-264 AA (IXFK)
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
IXYS reserves the right to change limits, test conditions, and dimensions.
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
g
fs
V
DS
= 10 V; I
D
= 0.5 I
D25
Note 1 40 70 S
C
iss
9100 pF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 1800 pF
C
rss
600 pF
t
d(on)
42 ns
t
r
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 0.5 I
D25
55 ns
t
d(off)
R
G
= 1 (External), 110 ns
t
f
40 ns
Q
g(on)
300 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 0.5 I
D25
57 nC
Q
gd
160 nC
R
thJC
0.22 K/W
R
thCK
0.15 K/W
Source-Drain Diode Characteristic Values
(T
J
= 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max.
I
S
V
GS
= 0 V 100 A
I
SM
Repetitive; 400 A
pulse width limited by T
JM
V
SD
I
F
= I
S
, V
GS
= 0 V, Note 1 1.5 V
t
rr
250 ns
Q
RM
1.4 µC
I
RM
10 A
I
F
= 50A,-di/dt = 100 A/µs, V
R
= 100 V
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.83 5.21 .190 .205
A
1
2.29 2.54 .090 .100
A
2
1.91 2.16 .075 .085
b 1.14 1.40 .045 .055
b
1
1.91 2.13 .075 .084
b
2
2.92 3.12 .115 .123
C 0.61 0.80 .024 .031
D 20.80 21.34 .819 .840
E 15.75 16.13 .620 .635
e 5.45 BSC .215 BSC
L 19.81 20.32 .780 .800
L1 3.81 4.32 .150 .170
Q 5.59 6.20 .220 0.244
R 4.32 4.83 .170 .190
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
4 - Drain (Collector)
PLUS 247
TM
Outline
Note: 1. Pulse test, t 300 µs, duty cycle d 2 %
IXFK 100N25
IXFX 100N25
TO-264 AA Outline
Millimeter Inches
Min. Max. Min. Max.
A 4.82 5.13 .190 .202
A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072
Dim.

IXFX100N25

Mfr. #:
Manufacturer:
Littelfuse
Description:
MOSFET 100 Amps 250V 0.027 Rds
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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