© Semiconductor Components Industries, LLC, 2005
October, 2016 − Rev. 6
1 Publication Order Number:
BCW66GLT1/D
BCW66GLT1G,
SBCW66GLT1G
General Purpose Transistor
NPN Silicon
Features
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−Emitter Voltage V
CEO
45 Vdc
Collector−Base Voltage V
CBO
75 Vdc
Emitter−Base Voltage V
EBO
5.0 Vdc
Collector Current − Continuous I
C
800 mAdc
Collector Current − Pulsed I
C
1200 mAdc
Stresses exceeding those listed in the Maximum Ratings table may damage
the device. If any of these limits are exceeded, device functionality should not
be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR−5 Board
(Note 1), T
A
= 25°C
Derate above 25°C
P
D
225
1.8
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
R
q
JA
556 °C/W
Total Device Dissipation Alumina
Substrate, (Note 2) T
A
= 25°C
Derate above 25°C
P
D
300
2.4
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
R
q
JA
417 °C/W
Junction and Storage Temperature T
J
, T
stg
−55 to +150 °C
1. FR−5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in 99.5% alumina.
SOT−23
(TO−236)
CASE 318
STYLE 6
MARKING DIAGRAM
COLLECTOR
3
1
BASE
2
EMITTER
EG = Specific Device Code
M = Date Code*
G = Pb−Free Package
Device Package Shipping
†
ORDERING INFORMATION
BCW66GLT1G SOT−23
(Pb−Free)
3,000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
EG MG
G
(*Note: Microdot may be in either location)
SBCW66GLT1G SOT−23
(Pb−Free)
3,000/Tape & Reel
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
BCW66GLT3G SOT−23
(Pb−Free)
10,000/Tape & Ree
www.onsemi.com