ADXL001
Rev. A | Page 11 of 16
THEORY OF OPERATION
DESIGN PRINCIPLES
The ADXL001 accelerometer provides a fully differential sensor
structure and circuit path for excellent resistance to EMI/RFI
interference.
This latest generation SOI MEMS device takes advantage
of mechanically coupled but electrically isolated differential
sensing cells. This improves sensor performance and size
because a single proof mass generates the fully differential
signal. The sensor signal conditioning also uses electrical
feedback with zero-force feedback for improved accuracy
and stability. This force feedback cancels out the electrostatic
forces contributed by the sensor circuitry.
Figure 19 is a simplified view of one of the differential sensor
cell blocks. Each sensor block includes several differential
capacitor unit cells. Each cell is composed of fixed plates attached
to the device layer and movable plates attached to the sensor
frame. Displacement of the sensor frame changes the differential
capacitance. On-chip circuitry measures the capacitive change.
MECHANICAL SENSOR
The ADXL001 is built using the Analog Devices SOI MEMS
sensor process. The sensor device is micromachined in-plane
in the SOI device layer. Trench isolation is used to electrically
isolate, but mechanically couple, the differential sensing elements.
Single-crystal silicon springs suspend the structure over the
handle wafer and provide resistance against acceleration forces.
UNIT
SENSING
CELL
MOVABLE
FRAME
FIXED
PLATES
UNIT
FORCING
CELL
ANCHOR
MOVING
PLATE
PLATE
CAPACITORS
ACCELERATION
ANCHOR
07510-019
Figure 19. Simplified View of Sensor Under Acceleration