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PRELIMINARY
PROTECTION PRODUCTS
EClamp2515K
Applications Information
Device Connection
The EClamp2515K is a microSD/T-Flash interface
device designed for use in cell phones and other
portable electronic devices. The EClamp2515K is
comprised of series and pull up resistors required on
the microSD interface. Each line also includes TVS
diodes for ESD protection.
The EClamp2515K is in a 16-pin SLP package. Electri-
cal connection is made to the 16 pins located at the
bottom of the device. The device has a flow through
design for easy layout. Pin connections are noted in
Figure 1. A center tab serves as the ground connec-
tion. Recommendations for the ground connection are
given below.
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering and ESD performance of the device.
Ground loop inductance can be reduced by using
multiple vias to make the connection to the ground
plane. Figure 2 shows the recommended device
layout. The ground pad vias have a diameter of 0.008
inches (0.20 mm) while the two external vias have a
diameter of 0.010 inches (0.250mm). The internal
vias are spaced approximately evenly from the center
of the pad. The designer may choose to use more vias
with a smaller diameter (such as 0.005 inches or
0.125mm) since changing the diameter of the via will
result in little change in inductance.
Figure 1 - Pin Identification and Configuration
(Top Side View)
DAT1 In
DAT0 In
CLK In
Rup
1
Vdd In
CMD In
DAT3 In
DAT2 In
DAT2 Out
DAT3 Out
CMD Out
Vdd (out)
No Connect
CLK Out
DAT1 Out
DAT0 Out
16
Figure 2 - Recommended Layout using Ground Vias
