NE1617A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 20 March 2012 4 of 30
NXP Semiconductors
NE1617A
Temperature monitor for microprocessor systems
6. Pinning information
6.1 Pinning
6.2 Pin description
[1] These pins should either float or be tied to ground.
[2] V
DD
pin should be decoupled by a 0.1 F capacitor.
Fig 2. Pin configuration for SSOP16 (QSOP16)
NE1617ADS
TEST1 TEST16
V
DD
STBY
D+ SCLK
D TEST13
TEST5 SDATA
ADD1 ALERT
GND ADD0
GND TEST9
002aad509
1
2
3
4
5
6
7
8
10
9
12
11
14
13
16
15
Table 2. Pin description
Symbol Pin Description
TEST1 1 test pin; factory use only
[1]
V
DD
2 positive supply
[2]
D+ 3 positive side of remote sensor
D 4 negative side of remote sensor
TEST5 5 test pin; factory use only
[1]
ADD1 6 device address 1 (3-state)
GND 7, 8 ground
TEST9 9 test pin; factory use only
[1]
ADD0 10 device address 0 (3-state)
ALERT
11 open-drain output used as interrupt or SMBus alert
SDATA 12 SMBus serial data input/output; open-drain
TEST13 13 test pin; factory use only
[1]
SCLK 14 SMBus clock input
STBY
15 hardware standby input
HIGH = normal operating mode
LOW = standby mode
TEST16 16 test pin; factory use only
[1]
NE1617A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 20 March 2012 5 of 30
NXP Semiconductors
NE1617A
Temperature monitor for microprocessor systems
7. Functional description
The NE1617A contains an integrating A-to-D converter, an analog multiplexer, a status
register, digital data registers, SMBus interface, associated control logic and a local
temperature sensor or channel (refer to Figure 1 “
Block diagram of NE1617A). The
remote diode-type sensor or channel should be connected to the D+ and D pins properly.
Temperature measurements or conversions are either automatically and periodically
activated when the device is in free-running mode (both STBY
pin = HIGH, and the
configuration register bit 6 = LOW) or generated by one-shot command. The free-running
period is selected by changing the programmable data of the conversion rate register, as
described in Section 8.3.4
. For each conversion, the multiplexer switches current sources
through the remote and local temperature sensors over a period of time, about 60 ms, and
the voltages across the diode-type sensors are sensed and converted into the
temperature data by the A-to-D converter. The resulting temperature data is then stored in
the temperature registers, in 8-bit two's complement word format and automatically
compared with the limits which have been programmed in the temperature limit registers.
Results of the comparison are reflected accordingly by the flags stored in the status
register, an out-of-limit condition will set the ALERT
output pin to its LOW state. Because
both channels are automatically measured for each conversion, the results are updated
for both channels at the end of every successful conversion.
7.1 Temperature measurement
The method of the temperature measurement is based on the change of the diode V
BE
at
two different operating current levels given by:
(1)
where:
V
BE
= change in base emitter voltage drop at two current levels
n = non-ideality
K = Boltzman’s constant
T = absolute temperature in Kelvin
q = charge on the electron
LN = natural logarithm
N = ratio of the two currents
The NE1617A forces two well-controlled current sources of about 10 A and 100 A and
measures the remote diode V
BE
. The sensed voltage between two pins D+ and D is
limited between 0.25 V and 0.95 V. The external diode must be selected to meet this
voltage range at these two current levels and also the non-ideality factor ‘n’ must be close
to the value of 1.008 to be compatible with the Intel Pentium III internal thermal diode that
the NE1617A was designed to work with. The diode-connected PNP transistor provided
on the microprocessor is typically used, or the discrete diode-connected transistor
2N3904 or 2N3906 is recommended as an alternative.
V
BE
n
KT
q
-------


LN N=
NE1617A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 5 — 20 March 2012 6 of 30
NXP Semiconductors
NE1617A
Temperature monitor for microprocessor systems
Even though the NE1617A integrating A-to-D converter has a good noise performance,
using the average of 10 measurement cycles, high frequency noise filtering between D+
and D should be considered. An external capacitor of 2200 pF typical (but not higher
than 3300 pF) connected between D+ and D is recommended. Capacitance higher than
3300 pF will introduce measurement error due to the rise time of the switched current
source.
7.2 No calibration is required
As mentioned in Section 7.1, the NE1617A uses two well-controlled current sources of
10 : 1 ratio to measure the forward voltage of the diode (V
BE
). This technique eliminates
the diode saturation current (a heavily process and temperature dependent variable), and
results in the forward voltage being proportional to absolute temperature.
7.3 Address logic
The address pins of the NE1617A can be forced into one of three levels: LOW (GND),
HIGH (V
DD
), or ‘not connected’ (n.c.). Because the NE1617A samples and latches the
address pins at the starting of every conversion, it is suggested that those address pins
should be hard-wired to the logic applied, so that the logic is consistently existed at the
address pins. During the address sensing period, the device forces a current at each
address pin and compares the voltage developed across the external connection with the
predefined threshold voltage in order to define the logic level. If an external resistor is
used for the connection of the address, then its value should be less than 2 k to prevent
the error in logic detection from happening. Resistors of 1 k are recommended.
8. Temperature monitor with SMBus serial interface
8.1 Serial bus interface
The device can be connected to a standard 2-wire serial interface System Management
Bus (SMBus) as a slave device under the control of a master device, using two device
terminals SCLK and SDATA. The operation of the device to the bus is described with
details in the following sections.
8.2 Slave address
The device address is defined by the logical connections applied to the device pins ADD0
and ADD1. A list of selectable addresses are shown in Table 3
. The device address can
be set to any one of those nine combinations and more than one device can reside on the
same bus without address conflict. Note that the state of the device address pins is
sampled and latched not only at power-up step, but also at starting point of every
conversion.
Table 3. Device slave address
n.c. = not connected
ADD0
[1]
ADD1
[1]
Address byte
GND GND 0011 000
GND n.c. 0011 001
GND V
DD
0011 010
n.c. GND 0101 001

NE1617ADS,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Board Mount Temperature Sensors I2C LOC +/- 2OC AND
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