SG1548J-DESC Datasheet SG1548J, SG1548J-DESC, SG1548J-883B | P7-P9

Application Information

Application Example

In this example, the SG1548 simultaneously monitors four DC voltages: +5V, +24V, and ±15V. Three

different fault tolerances are programmed: ±5% on the two 15V supplies, ±10% on the +5V supply, and

±20% on the +24V supply. The 5µF delay capacitor provides 125 milliseconds of fault delay.

V

REF

10.7 k

374

1.24 k

619

1.24 k

2.49 k

+24 V ± 20%

+5 V ± 10%

+15 V ± 5%

-15 V ± 5%

6.24 k

15 k

3.3 k

6 V

RMS

180 k

0.1

120 V

AC

60 Hz

GROUND

LINE SENSE

SENSE 4

INV. OUT

INV. IN

SENSE 3

SENSE 2

SENSE 1

+V

IN

O.V.FAULT

U.V.FAULT

V

REF

L. THRESHOLD

DELAY

COLLECTOR

1

2

3

4

5

14

16

15

13

12

11

9

10

8

7

6

OVERVOLTAGE

UNDERVOLTAGE

124 Ω

2.37 k

5 µF

LINE FAULT

EMITTER

BIAS SUPPLY

SG1548

Figure 2 · Application Example

7

QUAD POWER FAULT MONITOR

Package Outline Dimensions

Controlling dimensions are in inches, metric equivalents are shown for general information.

α

D

e

9

16

1

8

eA

b

H

b2

c

Seating Plane

E

A

Q

L

*

Note:

Dimensions do not include protrusions; these shall

not exceed 0.155mm (.006”) on any side. Lead

dimension shall not include solder coverage.

Dim

M

ILLIMETERS

I

NCHES

MIN

MAX

MIN

MAX

A

5.08

0.200

b

0.38

0.51

0.015

0.020

b2

1.04

1.65

0.045

0.065

c

0.20

0.38

0.008

0.015

D

19.30

19.94

0.760

0.785

E

5.59

7.11

0.220

0.280

e

2.54 BSC

0.100 BSC

eA

7.37

7.87

0.290

0.310

H

0.63

1.78

0.025

0.070

L

3.18

5.08

0.125

0.200

α

-

15°

-

15°

Q

0.51

1.02

0.020

0.040

Figure 3 · J 16-Pin Ceramic Dip

A

E1

D

e

b

L

E

c

θ

b1

S

EATING PLANE

1

A2

A1

Dim

MILLIMETERS

INCHES

MIN

MAX

MIN

MAX

A

5.33

0.210

A1

0.38

0.015

A2

3.30 Typ.

0.130 Typ.

b

0.36

0.56

0.014

0.022

b1

1.14

1.78

0.045

0.070

c

0.20

0.36

0.008

0.014

D

18.67

19.69

0.735

0.775

e

2.54 BSC

0.100 BSC

E

7.62

8.26

0.300

0.325

E1

6.10

7.11

0.240

0.280

L

2.92

0.381

0.115

0.150

θ

-

15°

-

15°

Note:

Dimensions do not include mold flash or protrusions;

these shall not exceed 0.155mm (.006”) on any side.

Lead dimension

shall not include solder coverage.

Figure 11 · N 16-Pin Plastic Dip

8

Package Outline Dimensions (continued)

Controlling dimensions are in inches, metric equivalents are shown for general information.

H

e

A2

A1

c

B

L

E

D

1

8

9

16

SEATING PLANE

A

Note:

1.

Controlled dimensions are in mm, inches are for

reference only.

2.

Dimensions do not include mold flash or protrusions;

these shall not exceed 0.155mm (.006”) on any side.

Lead dimension shall not include solder coverage.

Dim

M

ILLIMETERS

I

NCHES

MIN

MAX

MIN

MAX

A

2.06

2.65

0.081

0.104

A1

0.10

0.30

0.004

0.012

A2

2.03

2.55

0.080

0.100

B

0.33

0.51

0.013

0.020

c

0.23

0.32

0.009

0.013

D

10.08

10.50

0.397

0.413

E

7.40

7.60

0.291

0.299

e

1.27 BSC

0.05 BSC

H

10.00

10.65

0.394

0.419

L

0.40

1.27

0.016

0.050

Θ

0°

8°

0°

8°

*LC

−

0.10

−

0.004

Figure 12 · DW 16-Pin Plastic Wide-body SOIC

D

E3

L

L2

B1

e

B3

A2

A1

A

1

3

8

13

18

h

E

Note:

All exposed metalized area shall be gold plated

60 micro-inch minimum thickness over nickel

plated unless otherwise specified in purchase

order.

Dim

MILLIMETERS

INCHES

MIN

MAX

MIN

MAX

D/E 8.64 9.14 0.340 0.360

E3 - 8.128 - 0.320

e 1.270 BSC 0.050 BSC

B1 0.635 TYP 0.025 TYP

L

1.02

1.52

0.040

0.060

A 1.626 2.286 0.064 0.090

h 1.016 TYP 0.040 TYP

A1 1.372 1.68 0.054 0.066

A2 - 1.168 - 0.046

L2 1.91 2.41 0.075 0.95

B3 0.203R 0.008R

Figure 13 · 20-Pin Ceramic Leadless Chip Carrier

9

SG1548J-DESC

SG1548J-DESC

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