SQM50028EM_GE3

SQM50028EM
www.vishay.com
Vishay Siliconix
S17-0937-Rev. B, 19-Jun-17
1
Document Number: 74738
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Automotive N-Channel 60 V (D-S) 175 °C MOSFET
FEATURES
TrenchFET
®
power MOSFET
Package with low thermal resistance
100 % R
g
and UIS tested
AEC-Q101 qualified
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Notes
a. Package limited
b. Pulse test; pulse width 300 μs, duty cycle 2 %
c. When mounted on 1" square PCB (FR4 material)
PRODUCT SUMMARY
V
DS
(V) 60
R
DS(on)
(Ω) at V
GS
= 10 V 0.00200
I
D
(A) 120
Configuration Single
Package TO-263-7L
TO-263 7-Lead
Top View
G
D
S
G
D
S
D
G
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage V
DS
60
V
Gate-source voltage V
GS
± 20
Continuous drain current
a
T
C
= 25 °C
I
D
120
A
T
C
= 125 °C 120
Continuous source current (diode conduction)
a
I
S
120
Pulsed drain current
b
I
DM
240
Single pulse avalanche current
L = 0.1 mH
I
AS
75
Single pulse avalanche energy E
AS
281 mJ
Maximum power dissipation
b
T
C
= 25 °C
P
D
375
W
T
C
= 125 °C 125
Operating junction and storage temperature range T
J
, T
stg
-55 to +175 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL LIMIT UNIT
Junction-to-ambient PCB mount
c
R
thJA
40
°C/W
Junction-to-case (drain) R
thJC
0.4
SQM50028EM
www.vishay.com
Vishay Siliconix
S17-0937-Rev. B, 19-Jun-17
2
Document Number: 74738
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
a. Pulse test; pulse width 300 μs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing
c. Independent of operating temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-source breakdown voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 60 - -
V
Gate-source threshold voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 2.5 3.0 3.5
Gate-source leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V - - ± 100 nA
Zero gate voltage drain current I
DSS
V
GS
= 0 V V
DS
= 60 V - - 1
μA
V
GS
= 0 V V
DS
= 60 V, T
J
= 125 °C - - 50
V
GS
= 0 V V
DS
= 60 V, T
J
= 175 °C - - 250 μA
On-state drain current
a
I
D(on)
V
GS
= 10 V V
DS
5 V 100 - - A
Drain-source on-state resistance
a
R
DS(on)
V
GS
= 10 V I
D
= 30 A - 0.00163 0.00200
ΩV
GS
= 10 V I
D
= 30 A, T
J
= 125 °C - - 0.00300
V
GS
= 10 V I
D
= 30 A, T
J
= 175 °C - - 0.00360
Forward transconductance
b
g
fs
V
DS
= 15 V, I
D
= 30 A - 142 - S
Dynamic
b
Input capacitance C
iss
V
GS
= 0 V V
DS
= 25 V, f = 1 MHz
- 9100 11 900
pF Output capacitance C
oss
- 3550 4700
Reverse transfer capacitance C
rss
- 160 220
Total gate charge
c
Q
g
V
GS
= 10 V V
DS
= 30 V, I
D
= 50 A
- 123 185
nC Gate-source charge
c
Q
gs
-40-
Gate-drain charge
c
Q
gd
-19-
Gate resistance R
g
f = 1 MHz 4 8.6 13 Ω
Turn-on delay time
c
t
d(on)
V
DD
= 30 V, R
L
= 0.6 Ω
I
D
50 A, V
GEN
= 10 V, R
g
= 1 Ω
-4875
ns
Rise time
c
t
r
-2640
Turn-off delay time
c
t
d(off)
- 105 160
Fall time
c
t
f
-2540
Source-Drain Diode Ratings and Characteristics
b
Pulsed current
a
I
SM
- - 240 A
Forward voltage V
SD
I
F
= 50 A, V
GS
= 0 V - 0.84 1.5 V
Body diode reverse recovery time t
rr
I
F
= 25 A, di/dt = 100 A/μs
- 100 200 ns
Body diode reverse recovery charge Q
rr
- 243 500 nC
Reverse recovery fall time t
a
-48-
ns
Reverse recovery rise time t
b
-53-
Body diode peak reverse recovery current I
RM(REC)
--4.6- A
SQM50028EM
www.vishay.com
Vishay Siliconix
S17-0937-Rev. B, 19-Jun-17
3
Document Number: 74738
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (T
A
= 25 °C, unless otherwise noted)
Output Characteristics
Transconductance
Capacitance
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
10
100
1000
10000
0
30
60
90
120
150
0246810
Axis Title
1st line
2nd line
2nd line
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
2nd line
V
GS
= 10 V thru 5 V
V
GS
= 4 V
10
100
1000
10000
0
40
80
120
160
200
0 6 12 18 24 30
Axis Title
1st line
2nd line
2nd line
g
fs
- Transconductance (S)
I
D
- Drain Current (A)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C
10
100
1000
10000
0
2000
4000
6000
8000
10 000
0 1224364860
Axis Title
1st line
2nd line
2nd line
C - Capacitance (pF)
V
DS
- Drain-to-Source Voltage (V)
2nd line
C
rss
C
oss
C
iss
10
100
1000
10000
0
20
40
60
80
100
0246810
Axis Title
1st line
2nd line
2nd line
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
2nd line
T
C
= 25 °C
T
C
=-55 °C
T
C
= 125 °C
10
100
1000
10000
0.000
0.001
0.002
0.003
0.004
0.005
0 20406080100120
Axis Title
1st line
2nd line
2nd line
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
2nd line
V
GS
= 10 V
10
100
1000
10000
0
2
4
6
8
10
0 306090120150
Axis Title
1st line
2nd line
2nd line
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
2nd line
I
D
= 50 A
V
DS
= 30 V

SQM50028EM_GE3

Mfr. #:
Manufacturer:
Vishay
Description:
MOSFET N-CH 60V 120A TO263-7
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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