AD7414/AD7415
Rev. F | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
SDA Input Voltage to GND −0.3 V to +7 V
SDA Output Voltage to GND −0.3 V to +7 V
SCL Input Voltage to GND −0.3 V to +7 V
ALERT Output Voltage to GND −0.3 V to +7 V
Operating Temperature Range −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
5-Lead SOT-23 (RJ-5)
Power Dissipation
1, 2
W
MAX
= (T
JMAX
− T
A
)/θ
JA
Thermal Impedance
3
θ
JA
, Junction-to-Ambient (still air) 240°C/W
6-Lead SOT-23 (RJ-6)
Power Dissipation
1, 2
W
MAX
= (T
JMAX
− T
A
)/θ
JA
Thermal Impedance
3
θ
JA
, Junction-to-Ambient (still air) 190.4°C/W
8-Lead MSOP (RM-8)
Power Dissipation
1, 2
W
MAX
= (T
JMAX
− T
A
)/θ
JA
Thermal Impedance
3
θ
JA
, Junction-to-Ambient (still air) 205.9°C/W
θ
JC
, Junction-to-Case 43.74°C/W
IR Reflow Soldering
Peak Temperature 220°C (0°C/5°C)
Time at Peak Temperature 10 sec to 20 sec
Ramp-up Rate 3°C/s max
Ramp-down Rate
−6°C/s max
Ramp from 25°C to Peak Temperature 6 minutes max
IR Reflow Soldering in Pb-Free Package
Peak Temperature 260°C (0°C)
Time at Peak Temperature 20 sec to 40 sec
Ramp Rate 3°C/s max
Ramp-Down Rate
−6°C/s max
Ramp from 25°C to Peak Temperature 8 minutes max
1
Values relate to package being used on a standard 2-layer PCB.
2
T
A
= ambient temperature.
3
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, such as components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air-cooled, PCB-mounted
components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION