(0.50 mm) .0197"
BTH SERIES
BTH–090–01–F–D–A
BTH–030–01–L–D–RA–WT
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
Mates with:
BSH
Mates with:
BSH
BTH
BTH
NO. OF POSITIONS
PER ROW
NO. OF POSITIONS
PER ROW
D
D WT
PLATING
OPTION
PLATING
OPTION
–030, –050, –060,
–090, –120, –150
–030, –060, –090
OTHER
OPTION
OTHER
OPTION
A
RA
–K
= (7.00 mm)
.276" DIA
Polyimide Film
Pick
& Place Pad
–TR
= Tape & Reel
(120 positions
maximum)
–K
= (7.00 mm) .276" DIA
Polyimide Film Pick
& Place Pad
01
01
For complete specifications and
recommended PCB layouts see
www.samtec.com?BTH
Insulator Material: Black LCP
Contact Material:
Phosphor Bronze
Plating: Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating: 2.0 A per pin
(1 pin powered per row)
Flammability Rating: UL 94 VO
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating: 275 VAC
Max Cycles: 100
RoHS Compliant: Ye s
No. of Positions x (0.50) .01969
+ (5.00) .197
(3.94)
.155
(5.97)
.235
(0.50)
.01969
(0.20)
.008
(0.76)
.030
(4.27)
.168
(0.89)
.035
DIA
01
02
*Note: –C Plating passes 10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
SPECIFICATIONS
BASIC BLADE & BEAM HEADER
–F
= Gold Flash on contact, Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
–C*
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm)
Ni on Signal Pins in contact area,
Matte Tin over 50 µ" (1.27 µm) min
Ni on all solder tails
–F
= Gold Flash on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm) Gold on contact,
Matte Tin on tail
• Passes
10 year MFG
No. of Positions x (0.50) .01969 + (10.88) .428
(9.78)
.385
(3.05)
.120
(0.71)
.028
(0.64)
.025
SQ
(1.32)
.052
DIA
x
(1.32) (1.10)
.052 .043
02
(0.50)
.01969
(0.20)
.008
01
(5.97)
.235
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
ALSO AVAILABLE
(MOQ Required)
• 30 µ" (0.76 µm) Gold
• Edge Mount Capability
• 8 mm, 11 mm, 16 mm,
19 mm and 22 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may have
component height restrictions.
Please consult machinery
specifications.) (11 mm,
16 mm, 19 mm and 22 mm
not available with 50 positions)
Contact Samtec.
MATED HEIGHT
LEAD STYLE MATED HEIGHT*
–01
(5.00) .197
*Processing conditions will
affect mated height.
F-217
PROCESSING
Lead-Free Solderable: Ye s
SMT Lead Coplanarity:
Vertical=
(0.10 mm) .004" max (030-090)
Vertical=
(0.15 mm) .006" max (120-150)
Right-angle=
(0.15 mm) .006" max (030-090)
Board Stacking:
For applications requiring more
than two connectors per board
or 90 positions or higher, contact
ipg@samtec.com
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH MATING
CYCLES
