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STPS1L40ZFY

P1-P3P4-P6P7-P9P10-P12P13-P13
Characteristics
STPS1L40-Y
4/13
DocID018247 Rev 2
Figure 7: Relative variation of thermal impedance
junction to ambient versus pulse duration
Figure 8: Relative variation of thermal impedance
junction to lead versus pulse duration
Figure 9: Reverse leakage current versus reverse
voltage applied (typical values)
Figure 10: Junction capacitance versus reverse
voltage applied (typical values)
Figure 11: Forward voltage drop versus forward
current (typical values)
Figure 12: Thermal resistance junction to ambient
versus copper surface under each lead
(typical values)
Z
th(j-a)
/R
th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
SMB
t
P
(s)
Single pulse
Epoxy printed circuit board,
copper thickness = 35 µm, 
recommended pad layout
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
SOD123Flat
Z
th(j-l)
/R
th(j-l)
t
p
(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40
T
j
= 150 °C
T
j
= 125 °C
T
j
= 25 °C
T
j
= 100 °C
T
j
= 75 °C
T
j
= 50 °C
I
R
(mA)
V
R
(V)
10
100
1000
1 10 100
F = 1 MHz
V
OSC
= 30 mV
RMS
T
j
= 25 °C
C(pF)
V
R
(V)
R
th(j-a)
(°C/W)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMA
S
Cu
(cm²)
Epoxy printed board FR4, e
Cu
= 35 µm
STPS1L40-Y
Characteristics
DocID018247 Rev 2
5/13
Figure 13: Thermal resistance junction to ambient
versus copper surface under each lead
(typical values)
Figure 14: Thermal resistance junction to ambient
versus copper surface under each lead
(typical values)
R
th(j-a)
(°C/W)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMB
S
Cu
(cm²)
Epoxy printed board FR4, e
Cu
= 35 µm
0
50
100
150
200
250
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SOD123Flat
S
Cu
(cm²)
R
th(j-a)
(C/W)
Epoxy printed board FR4, e
Cu
= 35 µm
Package information
STPS1L40-Y
6/13
DocID018247 Rev 2
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Epoxy meets UL94, V0
Cooling method: by conduction (C)
2.1 SMA package information
Figure 15: SMA package outline
Table 5: SMA package mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.097
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.90
0.089
0.114
E
4.80
5.35
0.189
0.211
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
E
C
L
E1
D
A1
A2
b
P1-P3P4-P6P7-P9P10-P12P13-P13

STPS1L40ZFY

Mfr. #:
Buy STPS1L40ZFY
Manufacturer:
STMicroelectronics
Description:
Schottky Diodes & Rectifiers Automotive power Schottky rectifier
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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