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ATAES132-SH-EQ-T

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
13
ATAES132 [SPI SUMMARY DATASHEET]
Atmel-8763DS-CryptoAuth-ATAES132-SPI-Datasheet-Summary_072014
6. Part Markings
The part marking on the packages represents only variable manufacturing lot information and does not contain any
reference to the part number. Each reel or shipment may have different markings. Do not use the marking on the IC
package to determine product acceptance, instead, use the information on the shipment, reel, or box label.
7. Ordering Information
The ATAES132 production ordering codes are listed below. The ATAES132 packages are marked only with a lot trace
code and not the ordering code.
7.1 Ordering Codes
Note: 1. T = Tape and Reel
SOIC = 4K per reel
UDFN = 5K per reel
Note: 1. Lead-free, halogen-free package. Exceeds RoHS requirements.
ATAES132 Ordering Code Package Conditioning Interface Configuration Temperature Range
ATAES132-SH-EQ SOIC Bulk
SPI -40C to 85CATAES132-SH-EQ-T
(1)
SOIC Tape and Reel
ATAES132-MAH-EQ-T
(1)
UDFN Tape and Reel
Package Type
SOIC 8-pin SOIC, NiPdAu Lead Finish, Green
(1)
UDFN 8-pin UDFN/USON 2.00mm x 3.00mm, NiPdAu Lead Finish, Green
(1)
ATAES132 [SPI SUMMARY DATASHEET]
Atmel-8763DS-CryptoAuth-ATAES132-SPI-Datasheet-Summary_072014
14
7.2 Package Drawings
7.2.1 8S1 — 8-lead JEDEC SOIC
DRAWING NO. REV. TITLE GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 – 0.25
A 1.35 – 1.75
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.05
E1 3.81 – 3.99
E 5.79 – 6.20
e 1.27 BSC
L 0.40 – 1.27
Ø
Ø
0° – 8°
Ø
E
1
N
TOP VIEW
C
E1
END VIEW
A
b
L
A1
e
D
SIDE VIEW
Package Drawing Contact:
packagedrawings@atmel.com
8S1 G
6/22/11
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
SWB
15
ATAES132 [SPI SUMMARY DATASHEET]
Atmel-8763DS-CryptoAuth-ATAES132-SPI-Datasheet-Summary_072014
7.2.2 8MA2 — 8-pad UDFN
DRAWING NO. REV. TITLE
GPC
8MA2 F
6/6/14
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
YNZ
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.50 0.55 0.60
A1 0.0 0.02 0.05
A2 - - 0.55
D 1.90 2.00 2.10
D2 1.20 - 1.60
E 2.90 3.00 3.10
E2 1.20 - 1.60
b 0.18 0.25 0.30 3
C 1.52 REF
L 0.30 0.35 0.40
e 0.50 BSC
K 0.20 - -
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Package Drawing Contact:
packagedrawings@atmel.com
C
E
Pin 1 ID
D
8
7
6
5
1
2
3
4
A
A1
A2
D2
E2
e (6x)
L (8x)
b (8x)
Pin#1 ID
K
1
2
3
4
8
7
6
5
Notes: 1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

ATAES132-SH-EQ-T

Mfr. #:
Buy ATAES132-SH-EQ-T
Manufacturer:
Microchip Technology / Atmel
Description:
Security ICs / Authentication ICs AES 32Kbit EE SPI
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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