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Document Number: 72505
S11-0303-Rev. D, 28-Feb-11
Vishay Siliconix
DG3001, DG3002, DG3003
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Product is End of Life
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH, 165 µm BUMP HEIGHT)
Notes (Unless Otherwise Specified):
a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
Notes:
a. Use millimeters as the primary measurement.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72505
.
Index-Bump A1
Note c
Top Side (Die Back)
XXX
3003
Recommended Land Pattern
0.5
0.5
6 x Ø 0.150
∼ 0.229
Note b
Solder Mask Ø
∼ Pad Dia. + 0.1
Silicon
Bump
Note a
b Diameter
321
A
B
e
D
e
A
A
2
A
1
S
S
E
EUTECTIC (Sn/Pb)
Dim.
Millimeters
a
Inches
Min. Max. Min. Max.
A 0.610 0.685 0.0240 0.0270
A
1
0.140 0.190 0.0055 0.0075
A
2
0.470 0.495 0.0185 0.0195
b 0.180 0.250 0.0071 0.0098
D 1.490 1.515 0.0587 0.0596
E 0.990 1.015 0.0390 0.0400
e 0.5 BASIC 0.0197 BASIC
S 0.245 0.258 0.0096 0.0101
LEAD (Pb)-FREE (Sn/Ag/Cu)
Dim.
Millimeters
a
Inches
Min. Max. Min. Max.
A 0.688 0.753 0.0271 0.0296
A
1
0.218 0.258 0.0086 0.0102
A
2
0.470 0.495 0.0185 0.0195
b 0.306 0.346 0.0120 0.0136
D 1.490 1.515 0.0587 0.0596
E 0.990 1.015 0.0390 0.0400
e 0.5 BASIC 0.0197 BASIC
S 0.245 0.258 0.0096 0.0102
