PDTD123TS,126

PDTD123T_SER_3 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 03 — 16 November 2009 3 of 10
NXP Semiconductors
PDTD123T series
NPN 500 mA resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open
3. Ordering information
[1] Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9).
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Table 4. Ordering information
Type number Package
Name Description Version
PDTD123TK SC-59A plastic surface mounted package; 3 leads SOT346
PDTD123TS
[1]
SC-43A plastic single-ended leaded (through hole) package;
3 leads
SOT54
PDTD123TT - plastic surface mounted package; 3 leads SOT23
Table 5. Marking codes
Type number Marking code
[1]
PDTD123TK E9
PDTD123TS TD123TS
PDTD123TT *1T
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 50 V
V
CEO
collector-emitter voltage open base - 50 V
V
EBO
emitter-base voltage open collector - 5 V
V
I
input voltage
positive - +12 V
negative - 5V
I
O
output current - 500 mA
P
tot
total power dissipation T
amb
25 °C
[1]
SOT346 - 250 mW
SOT54 - 500 mW
SOT23 - 250 mW
T
stg
storage temperature 65 +150 °C
T
j
junction temperature - 150 °C
T
amb
ambient temperature 65 +150 °C
PDTD123T_SER_3 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 03 — 16 November 2009 4 of 10
NXP Semiconductors
PDTD123T series
NPN 500 mA resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
SOT346 - - 500 K/W
SOT54 - - 250 K/W
SOT23 - - 500 K/W
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
I
CBO
collector-base cut-off
current
V
CB
=40V; I
E
= 0 A - - 100 nA
V
CB
=50V; I
E
= 0 A - - 100 nA
I
CEO
collector-emitter
cut-off current
V
CE
=50V; I
B
=0A - - 0.5 μA
I
EBO
emitter-base cut-off
current
V
EB
=5V; I
C
= 0 A - - 100 nA
h
FE
DC current gain V
CE
=5V; I
C
= 50 mA 100 300 -
V
CEsat
collector-emitter
saturation voltage
I
C
=50mA; I
B
=2.5mA - - 0.3 V
R1 bias resistor 1 (input) 1.54 2.2 2.86 kΩ
C
c
collector capacitance V
CB
=10V; I
E
=i
e
=0A;
f=1MHz
-7-pF
PDTD123T_SER_3 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 03 — 16 November 2009 5 of 10
NXP Semiconductors
PDTD123T series
NPN 500 mA resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open
V
CE
=5V
(1) T
amb
= 100 °C
(2) T
amb
=25°C
(3) T
amb
= 40 °C
I
C
/I
B
=20
(1) T
amb
= 100 °C
(2) T
amb
=25°C
(3) T
amb
= 40 °C
Fig 1. DC current gain as a function of collector
current; typical values
Fig 2. Collector-emitter saturation voltage as a
function of collector current; typical values
006aaa447
I
C
(mA)
10
1
10
3
10
2
110
10
3
h
FE
10
2
(1)
(2)
(3)
006aaa448
I
C
(mA)
10
1
10
2
101
10
1
V
CEsat
(V)
10
2
(1)
(2)
(3)

PDTD123TS,126

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
TRANS PREBIAS NPN 500MW TO92-3
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet