PZUXBL_SER_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 May 2008 4 of 13
NXP Semiconductors
PZUxBL series
Single Zener diodes
6. Thermal characteristics
[1] Reflow soldering is the only recommended soldering method.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[4] Soldering point of cathode tab.
7. Characteristics
[1] Pulse test: t
p
≤ 300 µs; δ≤0.02.
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1][2]
- - 500 K/W
[1][3]
- - 250 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
[4]
--55K/W
Table 7. Characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V
F
forward voltage
[1]
I
F
= 10 mA - - 0.9 V
I
F
= 100 mA - - 1.1 V
Table 8. Characteristics per type; PZU2.4BL to PZU5.6B2L
T
j
=25
°
C unless otherwise specified.
PZUxxx Sel Working
voltage
V
Z
(V)
Differential resistance
r
dif
(Ω)
Reverse
current
I
R
(µA)
Temperature
coefficient
S
Z
(mV/K)
Diode
capacitance
C
d
(pF)
[1]
Non-repetitive
peak reverse
current
I
ZSM
(A)
[2]
I
Z
=5mA I
Z
= 0.5 mA I
Z
=5mA I
Z
=5mA
Min Max Max Max Max V
R
(V) Typ Max Max
2.4 B 2.3 2.6 1000 100 50 1 −1.6 450 8
2.7 B 2.5 2.9 1000 100 20 1 −2.0 440 8
B2 2.65 2.9
3.0 B 2.80 3.20 1000 95 10 1 −2.1 425 8
B2 2.95 3.20
3.3 B 3.10 3.50 1000 95 5 1 −2.4 410 8
B2 3.25 3.50
3.6 B 3.40 3.80 1000 90 5 1 −2.4 390 8
B2 3.55 3.80
3.9 B 3.70 4.10 1000 90 3 1 −2.5 370 8
B2 3.87 4.10
4.3 B 4.01 4.48 1000 90 3 1 −2.5 350 8
B2 4.15 4.34
