CS4122
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9
PACKAGE DIMENSIONS
SOIC−24 WB
DWF SUFFIX
CASE 751E−04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
−A−
−B− P12X
D24X
12
1324
1
M
0.010 (0.25) B
M
S
A
M
0.010 (0.25) B
S
T
−T−
G22X
SEATING
PLANE
K
C
R X 45
_
M
F
J
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 15.25 15.54 0.601 0.612
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G 1.27 BSC 0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M 0 8 0 8
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
____
PACKAGE THERMAL DATA
Parameter SOIC−24 WB Unit
R
q
JC
Typical 9 °C/W
R
q
JA
Typical 55 °C/W
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