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74LVC377DB,112
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74L
VC377_6
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 201
2. All rights rese
rved.
Product data sheet
Rev
. 06 — 20 November 2012
9 of 15
NXP Semiconductors
74L
VC377
Oct
al D-type flip-flop with dat
a enable; positive-edge trigger
12. Package
outline
Fig 7.
Package outline SOT1
63-1 (SO20)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
Q
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w
M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04
MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
99-12-27
03-02-19
74L
VC377_6
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 201
2. All rights rese
rved.
Product data sheet
Rev
. 06 — 20 November 2012
10 of 15
NXP Semiconductors
74L
VC377
Oct
al D-type flip-flop with dat
a enable; positive-edge trigger
Fig 8.
Package outline SOT3
39-1 (SSOP20)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
Q
(1)
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
0.9
0.7
0.9
0.5
8
0
o
o
0.13
1.25
0.2
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1
MO-150
99-12-27
03-02-19
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
11
0
20
11
y
0.25
pin 1 index
0
2.5
5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
A
max.
2
74L
VC377_6
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 201
2. All rights rese
rved.
Product data sheet
Rev
. 06 — 20 November 2012
1
1 of 15
NXP Semiconductors
74L
VC377
Oct
al D-type flip-flop with dat
a enable; positive-edge trigger
Fig 9.
Package outline SOT3
60-1 (TSSOP20)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1
MO-153
99-12-27
03-02-19
w
M
b
p
D
Z
e
0.25
11
0
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74LVC377DB,112
Mfr. #:
Buy 74LVC377DB,112
Manufacturer:
Nexperia
Description:
Flip Flops 3.3V OCTAL POS
Lifecycle:
New from this manufacturer.
Delivery:
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