NSI45060DDT4G

NSI45060DDT4G
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4
Figure 7. Power Dissipation vs. Ambient
Temperature @ T
J
= 1505C
T
A
, AMBIENT TEMPERATURE (°C)
80602002040
600
900
1500
1800
POWER DISSIPATION (mW)
40
700 mm
2
/2 oz
700 mm
2
/1 oz
500 mm
2
/1 oz
1200
2100
300
300 mm
2
/1 oz
500 mm
2
/2 oz
2400
2700
3000
300 mm
2
/2 oz
120100
3300
3600
3900
4200
APPLICATIONS
Q1 Q2
Anode
Qx
LED
HF3R5570
LED
HF3R5570
LED
HF3R5570
Cathode
Q1 Q2
Anode
LED
HF3R5570
Qx
LED
HF3R5570
LED
HF3R5570
LED
HF3R5570
LED
HF3R5570
LED
HF3R5570
LED
HF3R5570
Cathode
LED
HF3R5570
LED
HF3R5570
Figure 8. Typical Application Circuit
(30 mA each LED String)
Figure 9. Typical Application Circuit
(90 mA each LED String)
Number of LED’s that can be connected is determined by:
D1 is a reverse battery protection diode
LED’s = ((V
in
Q
X
V
F
D1 V
F
)/LED V
F
)
Example: V
in
= 12 Vdc, Q
X
V
F
= 3.5 Vdc, D1VF = 0.7 V
LED V
F
= 2.2 Vdc @ 30 mA
(12 Vdc 4.2 Vdc)/2.2 Vdc = 3 LEDs in series.
Number of LED’s that can be connected is determined by:
D1 is a reverse battery protection diode
Example: V
in
= 12 Vdc, Q
X
V
F
= 3.5 Vdc, D1VF = 0.7 V
LED V
F
= 2.6 Vdc @ 90 mA
(12 Vdc (3.5 + 0.7 Vdc))/2.6 Vdc = 3 LEDs in series.
Number of Drivers = LED current/30 mA
90 mA/30 mA = 3 Drivers (Q1, Q2, Q3)
+
+
D1 D1
V
in
V
in
R
adj
R
adj
R
adj
R
adj
R
adj
R
adj
NSI45060DDT4G
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5
Comparison of LED Circuit using CCR vs. Resistor Biasing
ON Semiconductor CCR Design Resistor Biased Design
Constant brightness over full Supply Voltage
(more efficient), see Figure 10
Large variations in brightness over full Automotive Supply Voltage
Little variation of power in LEDs, see Figure 11 Large variations of current (power) in LEDs
Constant current extends LED strings lifetime, see Figure 10 High Supply Voltage/ Higher Current in LED strings limits lifetime
Current decreases as voltage increases, see Figure 10 Current increases as voltage increases
Current supplied to LED string decreases as temperature
increases (self-limiting), see Figure 2
LED current decreases as temperature increases
Single resistor is used for current select Requires costly inventory
(need for several resistor values to match LED intensity)
Fewer components, less board space required More components, more board space required
Surface mount component Through-hole components
Figure 10. Series Circuit Current Figure 11. LED Power
V
in
(V) V
in
(V)
161514131211109
20
30
40
60
0
10
15 1614131211109
100
200
300
400
I (mA)
Pd LEDs (mW)
T
A
= 25°C
Circuit Current with
CCR Device
Circuit Current
with 125 W
Representative Test Data
for Figure 8 Circuit, Current
of LEDs, FR4 @ 300 mm
2
,
2 oz Copper Area
500
T
A
= 25°C
LED Power with
CCR Device
LED Power
with 125 W
Representative Test Data
for Figure 8 Circuit, Pd of
LEDs, FR4 @ 300 mm
2
,
2 oz Copper Area
0
600
50
80
70
Current Regulation: Pulse Mode (I
reg(P)
) vs DC
Steady-State (I
reg(SS)
)
There are two methods to measure current regulation:
Pulse mode (I
reg(P)
) testing is applicable for factory and
incoming inspection of a CCR where test times are a
minimum. (t < 300 ms). DC Steady-State (I
reg(SS)
) testing
is applicable for application verification where the CCR will
be operational for seconds, minutes, or even hours. ON
Semiconductor has correlated the difference in I
reg(P)
to
I
reg(SS)
for stated board material, size, copper area and
copper thickness. I
reg(P)
will always be greater than I
reg(SS)
due to the die temperature rising during I
reg(SS)
. This heating
effect can be minimized during circuit design with the
correct selection of board material, metal trace size and
weight, for the operating current, voltage, board operating
temperature (T
A
) and package. (Refer to Thermal
Characteristics table).
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6
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C01
ISSUE C
D
A
K
B
R
V
S
F
L
G
2 PL
M
0.13 (0.005) T
E
C
U
J
H
T
SEATING
PLANE
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.235 0.245 5.97 6.22
B 0.250 0.265 6.35 6.73
C 0.086 0.094 2.19 2.38
D 0.027 0.035 0.69 0.88
E 0.018 0.023 0.46 0.58
F 0.037 0.045 0.94 1.14
G 0.180 BSC 4.58 BSC
H 0.034 0.040 0.87 1.01
J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
L 0.090 BSC 2.29 BSC
R 0.180 0.215 4.57 5.45
S 0.025 0.040 0.63 1.01
U 0.020 −−− 0.51 −−−
V 0.035 0.050 0.89 1.27
Z 0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
123
4
5.80
0.228
2.58
0.101
1.6
0.063
6.20
0.244
3.0
0.118
6.172
0.243
ǒ
mm
inches
Ǔ
SCALE 3:1
RECOMMENDED FOOTPRINT
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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NSI45060DDT4G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
LED Lighting Drivers DPAK 60MA
Lifecycle:
New from this manufacturer.
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