BGU7033 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 2 — 13 September 2010 6 of 11
NXP Semiconductors
BGU7033
1 GHz wideband low-noise amplifier with bypass
8.2 Application circuit board layout
[1] L1 and R1 must have a power rating of 0.1 W or higher.
PCB material = FR4.
PCB thickness = 1.6 mm.
PCB size = 30 mm × 30 mm.
ε
r
= 4.5; thickness of copper layer = 35 μm.
Components are listed in Table 9
.
Fig 2. BGU7033 application circuit board layout
Table 9. List of components
See Figure 1
and Figure 2.
Component Description Value Remarks Function
C1, C2 capacitor 10 nF DC blocking
C3, C4, C5 capacitor 10 nF decoupling
C6 capacitor 10 μF decoupling
L1 chip ferrite bead 1.5 kΩ
[1]
Murata BLM18HE152SN1DF RF choke
R1 resistor 43 Ω
[1]
R
bias
bias setting
R2, R3 resistor 1.8 kΩ current limiting
X1, X2 connector 75 Ω F-connector, edge mount PCB
reflow type, Bomar 861V509ERG
input/output
001aam38
X1 X2
C6
R2
C3
C4
C1
C2
L1
R1
C5
R3
RF_OUTRF_IN
GND
CTRL2
GND
CTRL1
VCC
GND