Withdrawal Force
.75oz (0.21N) minimum per contact pair when tested with .062" (1.57mm) thick gauge
Insulation Resistance
Operating Temperature
Insertion Force
6oz (1.67N) maximum per contact pair when tested with .062" (1.57mm) thick gauge
Current Rating
Contact Resistance
Dielectric Withstand Voltage
500 VAC rms at sea level between adjacent contacts
Insulator Material
UL 94V-0 Polyphenylene Sulfide, Color: Black
Contact Material
Contact Plating
Gold Plating on mating area and Tin Plating on tails with Nickel underplating all over
301 SERIES
www.edac.net
Specifications:
FEATURES:
• EISA or ISA (IBM XT/AT) Daughter Boards Accommodated with
Bi-Level Contact Points and Card Slot Depths.
• .050" (1.27mm) Contact Spacing with Staggered Tail Bend
Results in 4 Rows at .100" (2.54mm) Spacing
• Accepts .062" (1.57mm) Nominal Thickness P.C. Board,
Accurately Positioned by Card Slot Barrier
• High Profile Insulator Body, .610" (15.49mm)
• Mounting Posts Provide Positive Location and Retention
• P.C. Tail Contact Termination
• RoHS Compliant
Series
Total Number of Contacts
Contact Code
Style
Example Part Number:
301-188-520-201
.120 (3.05)
.095 (2.41) DIA.
.050 (1.27)
E1
A1
.070 (1.78)
.098 (2.49)
F1
B1
(10.80)
.180 (4.57)
.101 (2.57)
BOTH ENDS
.610
(15.49)
.425
E1, F1
A1, B1
.375 (9.53)
.075 (1.91)
.058 (1.47)
3.300 (83.82)
C1
G1
H1
D1
5.100 (129.54)
.070 (1.78)
.114 (2.90)
5.510 (139.95)
.018 (0.46) X .013 (0.33) TAIL
3.050 (77.47)
.100 (2.54)
3.237 (82.22)
.078 (1.98) X .095 (2.41)
G1, H1
.086 (2.18)
C1, D1
1.850 (46.99)
2.065 (52.45)
.150 (3.81)
DEPTH
.500 (12.70)
ISA BOARD
CARD SLOT
.200 (5.08)
.300 (7.62)
AND LOWER TIER CONTACTS
ON THE SAME TIER)
.148 (3.76)
(OPPOSING CONTACTS ARE ACTUALLY
.054(1.37) TO .070 (1.78)
CARD SLOT ACCEPTS
(9.40)
.370
.100 (2.54)
THICK P.C. BOARD
SECTION THROUGH
SHOWING BOTH UPPER
CONTACT POSITION
.300
DEPTH
CARD SLOT
EISA BOARD
.165
(4.19)
(7.62)
BY-LEVEL POINTS OF CONTACT
AND CARD SLOT DEPTH
