Z-Power LED X10490Z-Power LED X10490
Technical Data Sheet
Rev. 03
Rev. 03
September 2010
September 2010
www.acriche.com
www.acriche.com
서식번호 : SSC-QP-7-07-25 (Rev.00)
14
Solder profile
1. Reflow solder conditions / profile
2. Hand Solder conditions
2-1 Lead : Not more than 3 seconds @MAX280℃
2-2 Slug : Use a thermal-adhesives
* Caution
[1] Reflow soldering should not be done more than one time.
[2] Repairing should not be done after the LEDs have been soldered. When
repairing is unavoidable, suitable tools have to be used.
[3] Die slug is to be soldered.
[4] When soldering, do not put stress on the LEDs during heating.
[5] After soldering, do not warp the circuit board.
[6] Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Reflow condition Pb-Free
assembly
Average ramp-up rate (TS-max to Peak) 2~3℃
/ second
Preheat Temperature Min (T
S-min) 150℃
Preheat Temperature Max (T
S-max) 200℃
Time maintained above: : Liquidus Temperature (TL) 217~220℃
Time maintained above: Time (t
L) 60~150 seconds
Peak Temperature (T
P) 250℃
Time within 5℃
of actual Peak Temperature (t
P) 20~40 seconds
ramp-down rate 4~6℃
/ second
Time 25℃
to Peak Temperature 6 minutes max
