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2-1735481-9

P1-P3P4-P6P7-P8
Characteristics STTH9012TV
4/8
Figure 3. Relative variation of thermal
impedance junction to case
versus pulse duration
Figure 4. Peak reverse recovery current
versus dI
F
/dt (typical values)
Z/R
th(j-c) th(j-c)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
t (s)
p
I (A)
RM
0
10
20
30
40
50
60
70
80
0 50 100 150 200 250 300 350 400 450 500
V
R
=600V
T
j
=125°C
I
F
= 2 x I
F(AV)
I
F
= I
F(AV)
I
F
= I
F(AV)
I
F
=0.5 x I
F(AV)
I
F
=0.5 x I
F(AV)
dI /dt(A/µs)
F
Figure 5. Reverse recovery time versus
dI
F
/dt (typical values)
Figure 6. Reverse recovery charges versus
dI
F
/dt (typical values)
t (ns)
rr
200
300
400
500
600
700
800
900
1000
0 50 100 150 200 250 300 350 400 450 500
V
R
=600V
T
j
=125°C
I
F
=0.5 x I
F(AV)
I
F
= 2 x I
F(AV)
I
F
=I
F(AV
)
I
F
=I
F(AV
)
dI /dt(A/µs)
F
Q (µC)
rr
0
2
4
6
8
10
12
0 50 100 150 200 250 300 350 400 450 500
I
F
=0.5 x I
F(AV)
I
F
= I
F(AV)
I
F
= 2 x I
F(AV)
V
R
=600V
T
j
=125°C
dI /dt(A/µs)
F
Figure 7. Softness factor versus
dI
F
/dt (typical values)
Figure 8. Relative variations of dynamic
parameters versus junction
temperature
S factor
0.50
0.75
1.00
1.25
1.50
1.75
2.00
0 50 100 150 200 250 300 350 400 450 500
I
F
= 2 x I
F(AV)
V
R
=600V
T
j
=125°C
dI /dt(A/µs)
F
0.00
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
25 50 75 100 125
I
RM
Q
RR
S
factor
I
F
= I
F(AV)
V
R
=600V
Reference: T
j
=125°C
t
RR
t
RR
T (°C)
j
STTH9012TV Characteristics
5/8
Figure 9. Transient peak forward voltage
versus dI
F
/dt (typical values)
Figure 10. Forward recovery time versus dI
F
/dt
(typical values)
Figure 11. Junction capacitance versus
reverse voltage applied (typical
values)
V (V)
FP
0
5
10
15
20
25
0 100 200 300 400 500
I
F
= I
F(AV)
T
j
=125°C
dI /dt(A/µs)
F
t (ns)
fr
200
400
600
800
1000
1200
1400
0 100 200 300 400 500
I
F
= I
F(AV)
V
FR
= 1.5 x V
F
max.
T
j
=125°C
dI /dt(A/µs)
F
C(pF)
10
100
1000
1 10 100 1000
F=1MHz
V
osc
=30mV
RMS
T
j
=25°C
V (V)
R
Package information STTH9012TV
6/8
2 Package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 5. ISOTOP dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max Min. Max.
A 11.80 12.20 0.465 0.480
A1 8.90 9.10 0.350 0.358
B 7.8 8.20 0.307 0.323
C 0.75 0.85 0.030 0.033
C2 1.95 2.05 0.077 0.081
D 37.80 38.20 1.488 1.504
D1 31.50 31.70 1.240 1.248
E 25.15 25.50 0.990 1.004
E1 23.85 24.15 0.939 0.951
E2 24.80 typ. 0.976 typ.
G 14.90 15.10 0.587 0.594
G1 12.60 12.80 0.496 0.504
G2 3.50 4.30 0.138 0.169
F 4.10 4.30 0.161 0.169
F1 4.60 5.00 0.181 0.197
P 4.00 4.30 0.157 0.69
P1 4.00 4.40 0.157 0.173
S 30.10 30.30 1.185 1.193
F1 F
D1
G
D
S
B
E1
G1
ØP
P1
E
E2
G2
C
C2
A1
A
P1-P3P4-P6P7-P8

2-1735481-9

Mfr. #:
Buy 2-1735481-9
Manufacturer:
TE Connectivity
Description:
Conn Board to Board RCP 180 POS 0.8mm Solder ST SMD Tube
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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